Gallium Nitride Materials and Devices XIII 2018
DOI: 10.1117/12.2287297
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Vertical GaN-based power devices on bulk GaN substrates for future power switching systems

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Cited by 9 publications
(10 citation statements)
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“…Thicker DW in SBDs with 30 μm DLs results in larger VBD. Figure 15 shows the plot of V BD vs. DLT for the state-of-the-art reported vertical SBDs [63][64][65][66][67][68]. Saitoh et al realized a V BD of 1100 V for the SBDs with DLT of 5 µm after using a field plate (FP) [63].…”
Section: Breakdown Voltage Of Sbdmentioning
confidence: 99%
See 1 more Smart Citation
“…Thicker DW in SBDs with 30 μm DLs results in larger VBD. Figure 15 shows the plot of V BD vs. DLT for the state-of-the-art reported vertical SBDs [63][64][65][66][67][68]. Saitoh et al realized a V BD of 1100 V for the SBDs with DLT of 5 µm after using a field plate (FP) [63].…”
Section: Breakdown Voltage Of Sbdmentioning
confidence: 99%
“…Saitoh et al realized a V BD of 1100 V for the SBDs with DLT of 5 µm after using a field plate (FP) [63]. Shibata, D. et al has reported the use of junction barrier Schottky (JBS) with p-type termination on SBDs with 13 µm thick DL to measure a V BD value of 1600 V [64]. The improvement in V BD was reported to be due to the reduction of CCD in the MOCVD grown GaN DLs [43,58].…”
Section: Breakdown Voltage Of Sbdmentioning
confidence: 99%
“…Some of the main features and benefits of GaN devices have reported in the literature [57][58][59][60][61][62][63][64], are reviewed and mentioned below:…”
Section: Complexity In Usementioning
confidence: 99%
“…In addition, vertical devices can potentially hold larger voltages by increasing their drift-layer thickness, thus enabling more devices per wafer. 13) Progress in growth and fabrication technology in the past years has led to the demonstration of high-performance GaN-on-GaN trench-gate MOSFETs, [14][15][16][17][18][19][20] VD-MOSFETs, 21) as well as vertical FinFETs. 22,23) In addition, quasi-and fully-vertical GaN-on-Si MOSFETs with promising figures of merit have been recently demonstrated, [24][25][26] thus combining the advantageous characteristics of GaN with the low-cost of Si substrates.…”
mentioning
confidence: 99%
“…A deep isolation mesa effectively increases the distance between the Schottky drain and the source and thus improves the V RB . Finally, the RB-MOSFET was benchmarked against other GaN vertical MOSFETs fabricated on bulk GaN, sapphire and on Si substrates [14][15][16][17][18][19][20][22][23][24][25][26][39][40][41] as shown in Fig. 5(a).…”
mentioning
confidence: 99%