2021
DOI: 10.1063/5.0047821
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Vertical β -Ga2O3 field plate Schottky barrier diode from metal-organic chemical vapor deposition

Abstract: Vertical β-Ga2O3 Schottky diodes from metal-organic chemical vapor deposition (MOCVD)-grown epitaxial films are reported in this paper for high-power application devices. The Schottky diode, fabricated with a field termination structure, showed a low differential specific on-resistance of 0.67 mΩ cm2. Furthermore, the MOCVD-grown β-Ga2O3 vertical Schottky diodes exhibited a punch-through breakdown and a higher Baliga's figure-of-merit compared to those from other epitaxial growth methods of similar drift layer… Show more

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Cited by 55 publications
(16 citation statements)
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“…The avalanche breakdown voltage, evaluated as the inflection point in the reverse current curves, decreases from 28.84 to 2.95 V with the increase of the P from 3 to 64 μW cm −2 , as shown in Figure 3b, due to the increased photo carrier density. The lateral depletion width in the Ga 2 O 3 APDs is estimated to be ≈0.72 μm, [34] and thus the avalanche breakdown electric fields of the APD with the P of 3-64 μW cm −2 are evaluated to be ≈0.04-0.40 MV cm −1 , as shown in Figure 3b, which are comparable to those of the reported Ga 2 O 3 APDs with n-n junctions (0.05 and 0.15 MV cm −1 ). [22,25] To evaluate the avalanche intensity, avalanche gain estimated as [I L (V)-I D (V)]/[I L (1)-I D (1)] is studied.…”
Section: Resultsmentioning
confidence: 99%
“…The avalanche breakdown voltage, evaluated as the inflection point in the reverse current curves, decreases from 28.84 to 2.95 V with the increase of the P from 3 to 64 μW cm −2 , as shown in Figure 3b, due to the increased photo carrier density. The lateral depletion width in the Ga 2 O 3 APDs is estimated to be ≈0.72 μm, [34] and thus the avalanche breakdown electric fields of the APD with the P of 3-64 μW cm −2 are evaluated to be ≈0.04-0.40 MV cm −1 , as shown in Figure 3b, which are comparable to those of the reported Ga 2 O 3 APDs with n-n junctions (0.05 and 0.15 MV cm −1 ). [22,25] To evaluate the avalanche intensity, avalanche gain estimated as [I L (V)-I D (V)]/[I L (1)-I D (1)] is studied.…”
Section: Resultsmentioning
confidence: 99%
“…Several researchers have reported using a field plate (FP) edge termination technique to redistribute the electric field at the SC metal periphery under reverse bias. Konishi et al fabricated FP-SBDs on HVPE-grown (001) epilayers on highly doped bulk conducting β-Ga 2 O 3 substrate as shown in Figure . Based on a two-dimensional device simulation using Silvaco ATLAS, a doping density of about 1 × 10 16 cm –3 in the drift region of 300 nm thick SiO 2 dielectric and FP length of 20 μm were targeted.…”
Section: Schottky Barrier Diodes On β-Ga2o3mentioning
confidence: 99%
“…β-Ga 2 O 3 , an emerging semiconductor material, exhibits immense potential for high-power electronics attributed to its remarkable fundamental material properties, including an ultra-wide bandgap of 4.8 eV , and a high critical field strength of 8 MV/cm . The advancement of β-Ga 2 O 3 -based Schottky diodes and transistors has greatly expanded its promises for power device applications. Moreover, the ability to control n-type doping within the range of 10 16 to 10 20 cm –3 , the successful epitaxial growth of semi-insulating layers, , and the availability of high-quality native substrates commercially confer significant advantages to β-Ga 2 O 3 for high-power device applications. Various methods have been employed to grow Ga 2 O 3 on different oriented β-Ga 2 O 3 substrates, such as molecular beam epitaxy (MBE), ,, pulsed laser deposition (PLD), halide vapor phase epitaxy (HVPE), , low-pressure chemical vapor deposition (LPCVD), and metalorganic chemical vapor deposition (MOCVD). , , In order to facilitate the application of high-performance power electronics with substantial breakdown capabilities, the incorporation of a thick drift layer becomes necessary.…”
Section: Introductionmentioning
confidence: 99%
“…However, high-growth-rate HVPE processes often result in considerable surface roughness, characterized by surface steps and pits, necessitating the implementation of a chemical–mechanical polishing (CMP) process for surface preparation and device fabrication. , Unfortunately, this additional step not only poses the risk of introducing impurities or contaminants onto the polished surface but also makes it challenging to perform in-situ heterojunction growth. Among the various growth techniques for β-Ga 2 O 3 , MOCVD stands out as the most promising one due to its ability to produce high-quality crystalline thin films with high mobility and low compensation, which are crucial for realizing the theoretically predicted performance of β-Ga 2 O 3 devices. ,, When triethylgallium (TEGa) is employed as the Ga precursor in MOCVD, the typical growth rate of β-Ga 2 O 3 ranges from 0.2 to 1.0 μm/h. , MOCVD-grown vertical β-Ga 2 O 3 field plate Schottky barrier diodes have exhibited a low differential specific on-resistance of 0.67 mΩ·cm 2 and a breakdown electric field of 2.42 MV/cm . However, the limited thickness of the drift layer (1.1 μm) poses a constraint on the breakdown voltage.…”
Section: Introductionmentioning
confidence: 99%