Van der Waals Layer Transfer of 2D Materials for Monolithic 3D Electronic System Integration: Review and Outlook

Abstract

Two-dimensional materials (2DMs) have attracted a great deal of interest due to their immense potential for scientific breakthroughs and technological innovations. While some 2D transition metal dichalcogenides (TMDC) such as MoS2 and WS2 are considered as the ultimate channel materials in unltrascaled transistors as replacements for Si, there has also been increasing interest in the monolithic 3D integration of 2DMs on the Si CMOS platform or in flexible electronics as back-end-of-line transistors, memory devices/selectors, and sensors, taking advantage of 2DM properties such as a high current driving capability with low leakage current, nonvolatile switching characteristics, a large surface-to-volume ratio, and a tunable bandgap. However, the realization of both of these scenarios critically depends on the development of manufacturing-viable high-yield 2DM layers transfer from the growth substrate to the Si, since the growth of high-quality 2DM layers often requires a high-temperature growth process on template substrates. Motivated by this, extensive efforts have been made by the 2DM research community to develop various 2DM layer transfer methods, leveraging the van der Waals transfer capability of the layer-structured 2DMs. These efforts have led to a number of successful demonstrations of wafer-scale 2D TMDC layer transfer, while 2DM-enabled template growth/transfer of some functional bulk materials such as III–V, Ge, and AlN has also been demonstrated. This review surveys and compares different 2DM transfer methods developed recently, with a focus on large-area 2D TMDC film transfer along with an introduction of 2DM template-assisted van der Waals growth/transfer of non-2D thin films. We will also briefly present an outlook of our envisioned multifunctionalities in 3D integrated electronic systems enabled by monolithic 3D integration of 2DMs and III–V via van der Waals transfer and discuss possible technology options for overcoming remaining challenges.

A Researcher’s Perspective on Unconventional Lab-to-Fab for 2D Semiconductor Devices

“…92 Although huge progress has been made in the large area 2D layer transfer technology recently, several obstacles still mar the three main steps of the transfer process, namely, low peeling yields; formation of cracks, wrinkles, or bubbles during the subsequent attachment to the target; and presence of polymer residues and incomplete release from carrier. 93 Hence, the development of robotic/automated systems (detacher and bonder) with precise control over detaching−attaching forces and peel-front propagation can be extremely useful in alleviating these issues. Automated detachers can help in the process by avoiding mechanical bending of the 2D material layer/film, which minimizes consequent crack propagation and also improves peeling yields.…”

Microneural Network System Based on MoS2/h-BN/Graphene van der Waals Heterojunction Transistor

“…The stacking ability of two-dimensional (2D) materials allows for the sequential combination of different 2D materials to form van der Waals (vdW) heterojunction, leveraging their no chemical bonds on the surface and weak vdW forces between adjacent layers. , Exploiting this vdW heterojunction, it becomes possible to integrate sensing, storage, and computation within a single transistor, eliminating delays and reducing energy consumption associated with data transmission, thus enhancing the performance of microneural network system. ,, Previous research has demonstrated the potential of neural networks based on a 2D material vdW heterojunction transistor. For instance, Zhou et al utilized BP/WS 2 /h-BN vdW heterojunction combined with neural networks to construct a multifunctional 2D disparity hardware device for motion detection and recognition .…”

A Review of Acoustic Devices Based on Suspended 2D Materials and Their Composites

“…Furthermore, compared with substrate supported material, suspended 2D materials yield superior advantages in terms of deformation and transduction mechanisms for acoustic devices. [33] Upon eliminating the interaction with the substrate (such as mechanical and thermal disruption), the substrate no longer hinders the material's vibration, deformation, and recovery process, thereby enabling the suspended material to respond independently and realize its full potential for high-performance acoustic devices. [29] In this review, we summarize the progress of acoustic devices based on suspended 2D materials and their composites, emphasizing the advantageous properties of suspended 2D membranes and related outstanding device performance (Figure 1).…”