“…Current millimeter-wave single-chip transceivers integrate transmit/receive function blocks, potentially including the power amplifier (PA), local oscillator (LO), and antenna together. Most such millimeter-wave transmit/receive MMICs were fabricated in GaAs technologies in the past [1]- [6], [19]- [21]; however, siliconbased(CMOS, silicon germanium heterojunction bipolar transistor (SiGe HBT) or BiCMOS) single-chip transmit/receive MMICs have been reported in the last two to three years [7]- [18], [22]. In this article, the current status of compound semiconductor and silicon-based millimeter-wave MMICs will be reviewed, and the future trends in millimeter-wave system on chip (SOC) will be discussed.…”