2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2016
DOI: 10.1109/impact.2016.7800076
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Using silicone as protective layer stacked under bga for lowering temperature in PVD process

Shih Chun Chen1,
Sheng I Huang2,
Ying Lin Chen3
et al.
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