Use of biporous wicks to remove high heat fluxes

Semenic, Tadej; Lin, Ying; Catton, I.; Sarraf, David B.

doi:10.1016/j.applthermaleng.2006.02.030

Cited by 80 publications

(38 citation statements)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Due to this enhancement mechanism, a 3 mm thick microgrooved wick structure exhibited a dryout heat flux of 350 W/cm 2 , compared to 0.5 mm and 3 mm thick monoporous wick structures that dried out soon after boiling incipience at or below 100 W/cm 2 [39]. This dryout heat flux of 100 W/cm 2 is lower than other monoporous sintered wicks in the literature [35,37] was likely due to the extremely small constituent particle size (13 μm effective pore radius). Further testing showed that 500 μm grooves outperform narrower 150 μm grooves that tend to remain partially filled with liquid.…”

Section: Efficient Liquid Feeding and Vapor Extraction Featuresmentioning

confidence: 80%

“…Catton and coworkers [35,36,63] were the first to study the capillary-fed boiling process from a small hot spot source (<100 mm 2 ), independent of single-phase capillary wicking limits, in the test facility shown in Figure 10. A biporous wick sample was sintered to a horizontal copper pedestal that was fed by capillary action from a liquid pool below with minimal flow resistance.…”

Section: Biporous Sintered Powdermentioning

confidence: 99%

“…This approach is similar to the experimental facility devised by Davis and Garimella [31], but incorporated an auxiliary charging port and sight glass to monitor and precisely control the liquid level [35]. The steady-state temperature drop across the wick structure was acquired as a function of heat input for a condenser temperature of 40 °C.…”

Section: Biporous Sintered Powdermentioning

confidence: 99%

“…The steady-state temperature drop across the wick structure was acquired as a function of heat input for a condenser temperature of 40 °C. In the initial study by Semenic et al [35], monoporous and biporous wicks were compared at a thickness of 1 mm.…”

Section: Biporous Sintered Powdermentioning

confidence: 99%

See 3 more Smart Citations

Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

Weibel

Garimella

2013

Advances in Heat Transfer

View full text Add to dashboard Cite

Owing to their high reliability, simplicity of manufacture, passive operation, and effective heat transport, flat heat pipes and vapor chambers are used extensively in the thermal management of electronic devices. The need for concurrent size, weight, and performance improvements in high-performance electronics systems, without resort to active liquid-cooling strategies, demands passive heat spreading technologies that can dissipate extremely high heat fluxes from small hot spots. In response to these daunting application-driven trends, a number of recent investigations have focused on the design, characterization, and fabrication of ultra-thin vapor chambers for proximate heat spreading away from these hot spots. The predominant transport mechanisms and operational limits have been found to be different under these conditions relative to conventional low-power heat pipes. Noteworthy advances in the fundamental understanding of evaporation and boiling from porous microstructures fed by capillary action, and improvements in vapor chamber characterization, modeling, design, and fabrication techniques are reviewed. Characterization of evaporation and boiling from idealized and realistic wick structures, observation of vapor formation regimes as a function of operating conditions, assessment of fluid dryout limitations, design of novel multi-scale and nanostructured wicks for enhanced transport, and incorporation of these high heat flux transport phenomena into device-level models are discussed. These recent developments have successfully extended the maximum operating heat flux limits of vapor chambers.2

show abstract

Section: Efficient Liquid Feeding and Vapor Extraction Featuresmentioning

confidence: 80%

Section: Biporous Sintered Powdermentioning

confidence: 99%

Section: Biporous Sintered Powdermentioning

confidence: 99%

Section: Biporous Sintered Powdermentioning

confidence: 99%

See 2 more Smart Citations

Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

Weibel

Garimella

2013

Advances in Heat Transfer

View full text Add to dashboard Cite

show abstract

“…The larger pores can increase the permeability of the working fluid in the vapor chamber. Dual pore vapor chambers can be used in high heat source applications (Semenic & Catton, 2009;Semenic et al, 2008). …”

Section: Copper Foam Characteristicsmentioning

confidence: 99%

Vapor Chamber Utilization for Rapid Cooling in the Conventional Plastic Injection Molding Process

Hasnan

Putra²,

Septiadi

et al. 2017

IJTech

View full text Add to dashboard Cite

Injection molding is the most common process for producing plastic products. The surface quality and the cycle time of the plastic product is strongly influenced by the cooling system, which accounts for approximately 70% of cycle time. In conventional injection molds, beryllium copper (BeCu) inserts are commonly used to speed up the cooling process and to obtain a uniform temperature distribution. This study aims to compare the abilities of the vapor chamber and the BeCu insert to increase the cooling rate and provide an even temperature distribution. The experiment was conducted with variations in heat inputs, cooling temperatures, and cooling rates. The vapor chamber had a copper foam wick with a pore diameter of 0.2 mm, filling ratio of 30%, and water as the working fluid. The vapor chamber provides an effective way to speed up the heat transfer process in injection molding, with heat transfer up to 67% greater than in conventional cooling methods that use BeCu.

show abstract

The Engineering History of Thermal Materials

Ababneh

2018

Bioinspired Engineering of Thermal Materials

View full text Add to dashboard Cite

Use of biporous wicks to remove high heat fluxes

Cited by 80 publications

References 4 publications

Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

Vapor Chamber Utilization for Rapid Cooling in the Conventional Plastic Injection Molding Process

The Engineering History of Thermal Materials

Contact Info

Product

Resources

About