Up to 80 Gbaud DP‐16QAM operation using InP‐based high‐bandwidth coherent driver modulator

Ozaki, Josuke; Ogiso, Yoshihiro; Hashizume, Yoshio; Kanazawa, Shigeru; Ueda, Yuta; Nunoya, Nobuhiro; Tanobe, Hiromasa; Ishikawa, Masahito

doi:10.1049/el.2019.1439

Cited by 4 publications

(7 citation statements)

References 5 publications

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“…These results confirmed that the bandwidth of the HB-CDM with the CMOS driver is high enough for 64-Gbaud or faster baud rates of up to 80 Gbaud, which correspond to a net data rate of 500-Gb/s capacity per wavelength. Furthermore, the BER characteristics of our HB-CDM with the CMOS driver are equivalent to those of the HB-CDM with the SiGe driver [20]. We have succeeded in significantly reducing power consumption without degrading the high-speed operation characteristics.…”

Section: Small-signal Eo Responsementioning

confidence: 92%

500-Gb/s/λ Operation of Ultra-Low Power and Low-Temperature-Dependence InP-Based High-Bandwidth Coherent Driver Modulator

Ozaki

Ogiso

Jyo

et al. 2020

J. Lightwave Technol.

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For 64-Gbaud operation and beyond, we developed a power efficient high-bandwidth coherent driver modulator composed of a linear four-channel ultra-low power CMOS driver IC and an InP-based dual-polarization IQ modulator. The CMOS driver was fabricated in 65-nm CMOS technology and showed power dissipation of <1 W owing to the use of an open-drain configuration and a stacked current-mode architecture. Moreover, by optimizing the temperature of the thermoelectric cooler that controls the modulator operating temperature, the coherent driver modulator achieved consumed power of <2.5 W at case temperatures of −5 to 75°C and <2.8 W under −5 to 85°C. As far as we know, this is the lowest power dissipation for a coherent driver modulator with an InP modulator chip. In addition, by employing a circuit that suppresses temperature dependence of RF characteristics in the CMOS driver, we achieved the 3-dB electro-optical bandwidth of >44 GHz and the variation of 2.0 GHz under the 25°to 85°C condition. Furthermore, we obtained good back-to-back bit-error-rate performance in up to dual polarization 80-Gbaud 16-QAM modulation.

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Section: Small-signal Eo Responsementioning

confidence: 92%

500-Gb/s/λ Operation of Ultra-Low Power and Low-Temperature-Dependence InP-Based High-Bandwidth Coherent Driver Modulator

Ozaki

Ogiso

Jyo

et al. 2020

J. Lightwave Technol.

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“…1, these transmission distances of 1122 and 336.6 km are, to the best of our knowledge, the longest in field experiments using DSP-ASIC-integrated real-time optical transponders with net data-rate > 0.4 Tb/s/carrier. The signals are generated and detected with our newly developed transponder that integrates a DSP-ASIC based on 16-nm complementary metal-oxide-semiconductor (CMOS) technology [17] and a high-bandwidth coherent driver modulator (HB-CDM) based on indium phosphide (InP) technology [18]. The modulation order must be higher than 16 to realize a capacity of >0.4 Tb/s/carrier with the symbol rate of ∼64 GBaud.…”

Section: Introductionmentioning

confidence: 99%

“…The experimental equipment was placed at building A; building B was only for directly connecting transmission lines. Our newly developed optical transponder consists of the DSP-ASIC based on 16nm CMOS technology [17], an InP-based HB-CDM [18], high-bandwidth intradyne coherent receiver (HB-ICR), and micro-integrable tunable laser assemblies (µITLAs) for signal and local oscillator (LO) sources. The measured signal was generated in the optical transponder; the electrical signals output from the DSP-ASIC were modulated by the InP-based HB-CDM in the optical frontend (FE) with the optical carrier output from a µITLA.…”

Section: Introductionmentioning

confidence: 99%

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Dual-Carrier 1-Tb/s Transmission Over Field-Deployed G.654.E Fiber Link Using Real-Time Transponder

Hamaoka

Sasai

Saito

et al. 2020

IEICE Trans. Commun.

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We demonstrated 1-Tb/s-class transmissions of fielddeployed large-core low-loss fiber links, which is compliant with ITU-T G.654.E, using our newly developed real-time transponder consisting of a state-of-the-art 16-nm complementary metal-oxide-semiconductor (CMOS) based digital signal processing application-specific integrated circuit (DSP-ASIC) and an indium phosphide (InP) based high-bandwidth coherent driver modulator (HB-CDM). In this field experiment, we have achieved record transmission distances of 1122 km for net data-rate 1-Tb/s transmission with dual polarization-division multiplexed (PDM) 32 quadrature amplitude modulation (QAM) signals, and of 336.6 km for net data-rate 1.2-Tb/s transmission with dual PDM-64QAM signals. This is the first demonstration of applying hybrid erbium-doped fiber amplifier (EDFA) and backward-distributed Raman amplifier were applied to terrestrial G.654.E fiber links. We also confirmed the stability of signal performance over field fiber transmission in wavelength division multiplexed (WDM) condition. The Q-factor fluctuations respectively were only less than or equal to 0.052 dB and 0.07 dB for PDM-32QAM and PDM-64QAM signals within continuous measurements for 60 minutes.

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“…For example, a high-bandwidth coherent driver modulator (HB-CDM) [1][2][3] and a high-bandwidth intradyne coherent receiver [4,5] have achieved high-speed operation up to 64 GBd with higherorder modulation formats up to 64QAM, and they are key components for constructing large-capacity optical communications systems. These modules employ surface mount lead structures for the RF interface.…”

mentioning

confidence: 99%

Crosstalk reduction between RF input channels of coherent‐driver‐modulator package by introducing enhanced ground lead structure

2020

Self Cite

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This Letter presents a novel RF ground lead structure for surface-mounttype optical modules that enables RF crosstalk reduction and bandwidth enhancements. Conventional RF lead-pins of a surface-mount-type optical module have a bent shape that affects on RF ground stability and RF crosstalk between channels. The authors introduced an enhanced ground lead with an optimised shape for RF ground scheme enhancement. They prepared two types of high-bandwidth coherent driver modulator packages for demonstrating RF performance difference, one with the conventional bent ground lead and the other with the optimum-shaped ground lead. The measured results of the package with the enhanced ground lead successfully exhibited adjacent far-end crosstalk reduction of about 5 dB at 50 GHz, and the crosstalk of −30 dB or less up to 58 GHz was confirmed. Moreover, they obtained the improvement in the insertion loss of 1 dB at 54 GHz and the 3-dB electrical bandwidth enhancement of 2 GHz. These RF performances are sufficient for a high-bandwidth coherent driver modulator package that allows 96-GBd class operations.

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Up to 80 Gbaud DP‐16QAM operation using InP‐based high‐bandwidth coherent driver modulator

Cited by 4 publications

References 5 publications

500-Gb/s/λ Operation of Ultra-Low Power and Low-Temperature-Dependence InP-Based High-Bandwidth Coherent Driver Modulator

500-Gb/s/λ Operation of Ultra-Low Power and Low-Temperature-Dependence InP-Based High-Bandwidth Coherent Driver Modulator

Dual-Carrier 1-Tb/s Transmission Over Field-Deployed G.654.E Fiber Link Using Real-Time Transponder

Crosstalk reduction between RF input channels of coherent‐driver‐modulator package by introducing enhanced ground lead structure

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