Abstract:Quantum computation requires many qubits that can be coherently controlled and coupled to each other [1]. Qubits that are defined using lithographic techniques are often argued to be promising platforms for scalability, since they can be implemented using semiconductor fabrication technology [2][3][4][5]. However, leading solidstate approaches function only at temperatures below 100 mK, where cooling power is extremely limited, and this severely impacts the perspective for practical quantum computation. Recent… Show more
“…[ 6,7 ] Second, charge noise hinders spin‐cavity coupling through the charge degree of freedom, [ 9–11 ] posing a challenge for designing efficient long‐range interconnects between qubits. Finally, for two‐qubit gates where the coupling between two electron spin qubits is achieved via the exchange interaction with strength J , [ 3,12–18 ] the charge noise results in J fluctuations during the two‐qubit gate operation limiting the overall gate fidelity. [ 3,15,16,19 ]…”
Section: Figurementioning
confidence: 99%
“…The σ ε values are typically measured using a double quantum dot system, where the fluctuations in the detuning energy ϵ between the two dots result in observable dephasing of coherent exchange oscillations. [ 3,15,17,39–44 ] Due to the 1/ f nature of charge noise, the integrated charge noise σ ε is dominated by the low‐frequency noise components. Therefore, it is desirable to keep the total measurement time T M as short as possible because it is T M that determines the low‐frequency limit of the noise bandwidth f low = 1/ T M .…”
Section: Figurementioning
confidence: 99%
“…As a result, the total measurement time T M used to completely map, for example, a full Rabi oscillation is typically on the order of seconds to hours. [ 3,17,44 ] Unfortunately, the T M times for the integrated charge noise measurements reported in the literature are not standardized, which prevents a direct comparison of σ ε values across different research groups and between different material platforms. [ 3,19,36,40–45 ] Within this work, we present σ ε as a function of T M , which provides a practical measure of the magnitude of the charge noise, that takes into account the bandwidth of the noise measurements to allow a straightforward comparison between different material systems.…”
100s 21 a) Value calculated using the noise spectrum (Equation (1)); b) A transition is observed between α = 1 and α = 2; c) Device implanted with P donors; d) Spin-orbit qubit; e) Singlet-triplet qubit formed between Si-MOS quantum dot and a P donor.
“…[ 6,7 ] Second, charge noise hinders spin‐cavity coupling through the charge degree of freedom, [ 9–11 ] posing a challenge for designing efficient long‐range interconnects between qubits. Finally, for two‐qubit gates where the coupling between two electron spin qubits is achieved via the exchange interaction with strength J , [ 3,12–18 ] the charge noise results in J fluctuations during the two‐qubit gate operation limiting the overall gate fidelity. [ 3,15,16,19 ]…”
Section: Figurementioning
confidence: 99%
“…The σ ε values are typically measured using a double quantum dot system, where the fluctuations in the detuning energy ϵ between the two dots result in observable dephasing of coherent exchange oscillations. [ 3,15,17,39–44 ] Due to the 1/ f nature of charge noise, the integrated charge noise σ ε is dominated by the low‐frequency noise components. Therefore, it is desirable to keep the total measurement time T M as short as possible because it is T M that determines the low‐frequency limit of the noise bandwidth f low = 1/ T M .…”
Section: Figurementioning
confidence: 99%
“…As a result, the total measurement time T M used to completely map, for example, a full Rabi oscillation is typically on the order of seconds to hours. [ 3,17,44 ] Unfortunately, the T M times for the integrated charge noise measurements reported in the literature are not standardized, which prevents a direct comparison of σ ε values across different research groups and between different material platforms. [ 3,19,36,40–45 ] Within this work, we present σ ε as a function of T M , which provides a practical measure of the magnitude of the charge noise, that takes into account the bandwidth of the noise measurements to allow a straightforward comparison between different material systems.…”
100s 21 a) Value calculated using the noise spectrum (Equation (1)); b) A transition is observed between α = 1 and α = 2; c) Device implanted with P donors; d) Spin-orbit qubit; e) Singlet-triplet qubit formed between Si-MOS quantum dot and a P donor.
“…In this work, the focus is on the design of a controller operating at 3 K because of the higher available cooling power. This does not restrict a future co-integration with qubits at the same temperature as the electronics since "hot" qubits operating at temperatures above 1 K have recently been demonstrated and are likely to evolve further in the next few years [20], [21].…”
Building a large-scale quantum computer requires the co-optimization of both the quantum bits (qubits) and their control electronics. By operating the CMOS control circuits at cryogenic temperatures (cryo-CMOS), and hence in close proximity to the cryogenic solid-state qubits, a compact quantumcomputing system can be achieved, thus promising scalability to the large number of qubits required in a practical application. This work presents a cryo-CMOS microwave signal generator for frequency-multiplexed control of 4 × 32 qubits (32 qubits per RF output). A digitally intensive architecture offering full programmability of phase, amplitude, and frequency
“…The co-integration of the qubits and the peripheral electronics on the same substrate, the so-called quantum-integrated circuits, would be the following step in the quantum computing roadmap. Recent studies have already demonstrated silicon qubit operating above 1 K [4], [5]. With further engineering of qubits, it might be possible to increase the operating temperature of qubits to ~4.2 K, therefore having the whole system operating at that temperature.…”
This work presents a detailed RF characterization of 28-nm FD-SOI nMOSFETs at cryogenic temperatures down to 4.2 K. Two main RF Figures of Merit (FoMs), i.e. current-gain cutoff frequency (ft) and maximum oscillation frequency (fmax), as well as parasitic elements of the small-signal equivalent circuit, are extracted from the measured S-parameters. An improvement of up to ~130 GHz in ft and ~75 GHz in fmax is observed for the shortest device (25 nm) at low temperature. The behavior of RF FoMs versus temperature is discussed in terms of small-signal equivalent circuit elements, both intrinsic and extrinsic (parasitics). This study suggests 28-nm FD-SOI nMOSFETs as a good candidate for future cryogenic applications down to 4.2 K and clarifies the origin and limitations of the performance.
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