2015
DOI: 10.1016/j.egypro.2015.07.110
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Universal Passivation for p++ and n++ Areas on IBC Solar Cells

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Cited by 7 publications
(5 citation statements)
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“…Compared to AlO x /SiN x :H, the limited a-Si:H passivation on the (p + ) c-Si surface is a striking result of this experiment. Such effect was previously evidenced for highly doped homo-emitters obtained from homojunction-type boron diffusion with saturation current densities J 0e above 100 fAcm −2 and sheet resistances lower than 200 Ω/ϒ [46,47].…”
Section: A-si:h Passivation On Boron-doped Surfacessupporting
confidence: 59%
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“…Compared to AlO x /SiN x :H, the limited a-Si:H passivation on the (p + ) c-Si surface is a striking result of this experiment. Such effect was previously evidenced for highly doped homo-emitters obtained from homojunction-type boron diffusion with saturation current densities J 0e above 100 fAcm −2 and sheet resistances lower than 200 Ω/ϒ [46,47].…”
Section: A-si:h Passivation On Boron-doped Surfacessupporting
confidence: 59%
“…Thus, the involved mechanism seems to be related to as-deposited a-Si:H hydrogen content and H configuration variation from poly-hydride to mono-hydride configurations upon annealing [17]. J 0e values as low as 30 fAcm −2 for 30 nm thick (i) a-Si:H passivation on a stronger diffused homo-emitter (R □ = 90 Ω/□) have been reported using a 150°C deposition temperature and post-deposition annealing of 5 min at 350°C [47]. Additional post-process annealing steps up to 300°C have been performed on our samples but no effective lifetime increase has been observed.…”
Section: A-si:h Passivation On Boron-doped Surfacesmentioning
confidence: 96%
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“…Successful application of a‐Si films to different cell architectures has continued to expand as for example noted in Refs. . The main disadvantage of a‐Si films is, however, the sensitivity to subsequent high‐temperature processes which are often required in industrial manufacturing technology.…”
Section: Materials and Methods For Silicon Surface Passivationmentioning
confidence: 99%
“…Details on the complete process sequence are published elsewhere. 8,31) Figures 8(a)-8(d) illustrate the four laser processes: First, laser doping of the boron emitter from a sputtered boron containing source, where a nanosecond pulsed line focused laser beam 32,33) with a wavelength of λ = 532 nm and a pulse duration of approximately 50 ns, scans over the wafer surface and locally dopes the emitter [see Fig. 8(a)].…”
Section: Application: Laser Processed Back Contact Solar Cellsmentioning
confidence: 99%