2019
DOI: 10.1109/jmems.2018.2881510
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Uniform Metal-Assisted Chemical Etching for Ultra-High-Aspect-Ratio Microstructures on Silicon

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Cited by 20 publications
(21 citation statements)
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“…30,31 On the other hand, uniform high aspect ratios have been reported for a nanoporous Au catalyst in conditions of low HF and high H 2 O 2 concentration. 32,33 Under these conditions the etching is more isotropic, 34 the tops of the trenches appear wider with respect to the bottom compromising the fidelity of the pattern in the lateral dimension, so the process is not suitable for high aspect ratio nanostructures.…”
Section: Pt Catalyst Pattern For Nanowire Fabricationmentioning
confidence: 99%
See 1 more Smart Citation
“…30,31 On the other hand, uniform high aspect ratios have been reported for a nanoporous Au catalyst in conditions of low HF and high H 2 O 2 concentration. 32,33 Under these conditions the etching is more isotropic, 34 the tops of the trenches appear wider with respect to the bottom compromising the fidelity of the pattern in the lateral dimension, so the process is not suitable for high aspect ratio nanostructures.…”
Section: Pt Catalyst Pattern For Nanowire Fabricationmentioning
confidence: 99%
“…The use of an interconnected pattern has been demonstrated to effectively reduce the off-vertical catalyst movement. 29,32,33 De-wetting occurs when a thin film on a solid substrate is heated, inducing clustering of the film. 41 The film structure morphology (feature size, roughness, pores distribution) and the pattern evolution strongly depend on the film/substrate parameters (film material, film thickness, substrate material, defects) and the experimental conditions (deposition rate, annealing temperature, annealing environment etc.).…”
Section: Pt Catalyst Pattern For Nanowire Fabricationmentioning
confidence: 99%
“…movement. [16][17][18] The nanopore morphology allows the MacEtch reactants to pass through the catalyst spacing, significantly improving the mass transport and uniformity, which ensures a highly uniform etch rate over the catalyst area.…”
Section: Platinum Thermal Dewettingmentioning
confidence: 99%
“…Gold catalyst suffers of bad adhesion on silicon substrates, yet a detrimental pattern peel-off has been reported during MacEtch in conditions of high HF concentration [50,65]. On the other hand, uniform high aspect ratio has been reported for nanoporous Au catalyst in conditions of low HF and high H 2 O 2 concentration [39,66]. In these conditions, the etching is more isotropic [63], the top of the trenches appear wider with respect to the bottom compromising the fidelity of the pattern transfer in the lateral dimension, so the process is not suitable for high aspect ratio structures.…”
Section: Catalystmentioning
confidence: 99%
“…Porous catalyst film is reported [2,63,66,67] to improve the etching performances of micro-scaled Si trenches structures with interconnected catalyst pattern. The porous morphology of the film allows the MacEtch reactants to pass through the catalyst spacing, significantly improving the mass transport and uniformity, which ensures a highly uniform etch rate over all the catalyst area.…”
Section: Catalystmentioning
confidence: 99%