“…3a and b at two different temperatures 300 and 400 K, respectively. The missing measurement points for both static characteristics are lying within the destructive U-shaped line and can, therefore, not be measured without device destruction In (1), E SC is the energy applied during SC pulse, which is given by the applied voltage (V CE ), SC current (I SC ) and SC time duration (t sc ). C th is the thermal capacitance, c th,si is the lattice or specific heat capacity of silicon, ρ is the density of silicon, d is the thickness and A is the area of the IGBT chip…”
Section: Measurement Of Igbt I-v Characteristicsmentioning
confidence: 99%
“…Many authors have investigated the SC-SOA for different voltage classes ranging from 1200 to 6500 V [1][2][3][4][5][6][7][8][9]. A hypothesis was developed for device destruction based on simulation results, explaining the avalanche generation rate exceeding the critical value near n-base/n-field-stop junction [6][7][8].…”
Section: Introductionmentioning
confidence: 99%
“…The SC ruggedness is defined as the capability of the IGBT to withstand both a high voltage and high current simultaneously for a certain time interval (e.g. 10 µs) [1]. A detailed investigation of the IGBTs is required for a deep understanding of how the current filaments become a physical limit for the device destruction.…”
Section: Introductionmentioning
confidence: 99%
“…A detailed investigation of the IGBTs is required for a deep understanding of how the current filaments become a physical limit for the device destruction. The destruction due to the current filaments was named as electrical destructions at which the device destroys at much lower energy than the critical energy of the chip [1]. These current destructions occur far beyond the safe operating area (SOA).…”
Section: Introductionmentioning
confidence: 99%
“…Measured critical current as a function of V CE with two different parasitic inductances at T start = 300 K and R G = 220 Ω SC in I C-V CE phase space diagram for last pass and destructive pulse at V DC = 400 V, V GE = 25 V, R G = 220 Ω and T start = 300 K (a) L par = 45 nH, (b) L par = 380 nHparameter[1]. In…”
This work investigates modification on the top-side aluminium (Al) metallisation of 1.2 kV insulated-gate bipolar transistors (IGBTs) under repetitive short-circuit (SC) type-I measurements for two different parasitic inductances of 45 and 380 nH. The presence of current-density filaments starting at the collector side during SC leads to local temperature increase of the emitter metallisation and thus to modification of the top Al surface in the pattern of the current filaments. Here, two techniques thermo-reflectance microscopy, which can detect the surface temperature during repetitive short circuits directly and Al modifications after repetitive SC with analysis under optical microscope after the test have been considered. At 45 nH, with different DC-link voltages from 300 to 600 V, the Al modification pattern is non-uniform and it becomes uniform for V DC >600 V. However, for 380 nH parasitic inductance and for DC-link voltages 300 and 400 V, the Al reconstruction shows a non-uniform pattern and becomes uniform for V DC ≥500 V. The SC simulations were performed by using a simplified front-side IGBT structure using variable DC-link voltages and inductances to reproduce the filament behaviour.
“…3a and b at two different temperatures 300 and 400 K, respectively. The missing measurement points for both static characteristics are lying within the destructive U-shaped line and can, therefore, not be measured without device destruction In (1), E SC is the energy applied during SC pulse, which is given by the applied voltage (V CE ), SC current (I SC ) and SC time duration (t sc ). C th is the thermal capacitance, c th,si is the lattice or specific heat capacity of silicon, ρ is the density of silicon, d is the thickness and A is the area of the IGBT chip…”
Section: Measurement Of Igbt I-v Characteristicsmentioning
confidence: 99%
“…Many authors have investigated the SC-SOA for different voltage classes ranging from 1200 to 6500 V [1][2][3][4][5][6][7][8][9]. A hypothesis was developed for device destruction based on simulation results, explaining the avalanche generation rate exceeding the critical value near n-base/n-field-stop junction [6][7][8].…”
Section: Introductionmentioning
confidence: 99%
“…The SC ruggedness is defined as the capability of the IGBT to withstand both a high voltage and high current simultaneously for a certain time interval (e.g. 10 µs) [1]. A detailed investigation of the IGBTs is required for a deep understanding of how the current filaments become a physical limit for the device destruction.…”
Section: Introductionmentioning
confidence: 99%
“…A detailed investigation of the IGBTs is required for a deep understanding of how the current filaments become a physical limit for the device destruction. The destruction due to the current filaments was named as electrical destructions at which the device destroys at much lower energy than the critical energy of the chip [1]. These current destructions occur far beyond the safe operating area (SOA).…”
Section: Introductionmentioning
confidence: 99%
“…Measured critical current as a function of V CE with two different parasitic inductances at T start = 300 K and R G = 220 Ω SC in I C-V CE phase space diagram for last pass and destructive pulse at V DC = 400 V, V GE = 25 V, R G = 220 Ω and T start = 300 K (a) L par = 45 nH, (b) L par = 380 nHparameter[1]. In…”
This work investigates modification on the top-side aluminium (Al) metallisation of 1.2 kV insulated-gate bipolar transistors (IGBTs) under repetitive short-circuit (SC) type-I measurements for two different parasitic inductances of 45 and 380 nH. The presence of current-density filaments starting at the collector side during SC leads to local temperature increase of the emitter metallisation and thus to modification of the top Al surface in the pattern of the current filaments. Here, two techniques thermo-reflectance microscopy, which can detect the surface temperature during repetitive short circuits directly and Al modifications after repetitive SC with analysis under optical microscope after the test have been considered. At 45 nH, with different DC-link voltages from 300 to 600 V, the Al modification pattern is non-uniform and it becomes uniform for V DC >600 V. However, for 380 nH parasitic inductance and for DC-link voltages 300 and 400 V, the Al reconstruction shows a non-uniform pattern and becomes uniform for V DC ≥500 V. The SC simulations were performed by using a simplified front-side IGBT structure using variable DC-link voltages and inductances to reproduce the filament behaviour.
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