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2018
DOI: 10.1016/j.microrel.2018.06.091
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Unified view on energy and electrical failure of the short-circuit operation of IGBTs

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Cited by 14 publications
(15 citation statements)
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“…3a and b at two different temperatures 300 and 400 K, respectively. The missing measurement points for both static characteristics are lying within the destructive U-shaped line and can, therefore, not be measured without device destruction In (1), E SC is the energy applied during SC pulse, which is given by the applied voltage (V CE ), SC current (I SC ) and SC time duration (t sc ). C th is the thermal capacitance, c th,si is the lattice or specific heat capacity of silicon, ρ is the density of silicon, d is the thickness and A is the area of the IGBT chip…”
Section: Measurement Of Igbt I-v Characteristicsmentioning
confidence: 99%
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“…3a and b at two different temperatures 300 and 400 K, respectively. The missing measurement points for both static characteristics are lying within the destructive U-shaped line and can, therefore, not be measured without device destruction In (1), E SC is the energy applied during SC pulse, which is given by the applied voltage (V CE ), SC current (I SC ) and SC time duration (t sc ). C th is the thermal capacitance, c th,si is the lattice or specific heat capacity of silicon, ρ is the density of silicon, d is the thickness and A is the area of the IGBT chip…”
Section: Measurement Of Igbt I-v Characteristicsmentioning
confidence: 99%
“…Many authors have investigated the SC-SOA for different voltage classes ranging from 1200 to 6500 V [1][2][3][4][5][6][7][8][9]. A hypothesis was developed for device destruction based on simulation results, explaining the avalanche generation rate exceeding the critical value near n-base/n-field-stop junction [6][7][8].…”
Section: Introductionmentioning
confidence: 99%
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