2021 IEEE International Integrated Reliability Workshop (IIRW) 2021
DOI: 10.1109/iirw53245.2021.9635621
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Understanding the Reliability of Ferroelectric Tunnel Junction Operations using an Advanced Small-Signal Model

Abstract: Ferroelectric technology is becoming ever more appealing for a variety of applications, especially analog neuromorphic computing. In this respect, elucidating the physical mechanisms occurring during device operation is of key importance to improve the reliability of ferroelectric devices. In this work, we investigate ferroelectric tunnel junctions (FTJs) consisting of a ferroelectric hafnium zirconium oxide (HZO) layer and an alumina (Al2O3) layer by means of C-f and G-f measurements performed at multiple vol… Show more

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Cited by 5 publications
(10 citation statements)
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References 15 publications
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“…The paper extends our previous conference paper [5] by providing a more detailed explanation on the model parameter's extraction methodology, together with the sensitivity analysis that encompasses all the parameters in the model and other modeling attempts comparison.…”
Section: Introductionmentioning
confidence: 79%
“…The paper extends our previous conference paper [5] by providing a more detailed explanation on the model parameter's extraction methodology, together with the sensitivity analysis that encompasses all the parameters in the model and other modeling attempts comparison.…”
Section: Introductionmentioning
confidence: 79%
“…In this research, we extend our conference paper [35] and expand upon our previous findings on the validation of the small-signal model for ferroelectric tunnel junctions (FTJs) [33], [34], also used to investigate aging mechanisms [36], and examine the electrical response of FTJs with a metaldielectric-ferroelectric-metal (MDFM) stack at various voltages through multi-voltage capacitancefrequency/conductance-frequency (C-f/G-f) measurements.…”
Section: Introductionmentioning
confidence: 66%
“…(CSER//GSER) to model the parasitic impedance of the access metal lines, which cannot be removed with open-circuit and/or short-circuit compensation [33], [34], which are however performed before the measurements. A Cit-Git branch is also inserted between the TiN electrodes (for MFM and MDM) to model to the first order the presence of interface defects at the parasitic TiON / TiAlO layers caused by post-deposition annealing [28], [38].…”
Section: Device and Experimentsmentioning
confidence: 99%
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