2016
DOI: 10.1016/j.jcrysgro.2016.02.028
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Understanding the effects of Si (111) nitridation on the spontaneous growth and properties of GaN nanowires

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Cited by 20 publications
(17 citation statements)
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“…This procedure was adopted to avoid the formation of an amorphous SiN x layer at the nitride/silicon interface. Such an amorphous layer has been reported in transmission electron microscopy (TEM) studies of AlN films grown on Si(111) by metal‐organic vapor phase epitaxy, of PAMBE GaN films and nanowires on Si, and also for PAMBE deposited InN nanowires on Si . Interestingly, this previous study also reported an absence of amorphous SiN x at the interface between a PAMBE AlN layer and Si(111) .…”
Section: Introductionsupporting
confidence: 59%
“…This procedure was adopted to avoid the formation of an amorphous SiN x layer at the nitride/silicon interface. Such an amorphous layer has been reported in transmission electron microscopy (TEM) studies of AlN films grown on Si(111) by metal‐organic vapor phase epitaxy, of PAMBE GaN films and nanowires on Si, and also for PAMBE deposited InN nanowires on Si . Interestingly, this previous study also reported an absence of amorphous SiN x at the interface between a PAMBE AlN layer and Si(111) .…”
Section: Introductionsupporting
confidence: 59%
“…The second RC element (R 2 Q 2 ) described the GaN/silicon interface which hinders electrons transfer due to the presence of the large bandgap insulating SiN x interfacial layer, Fig. 5(b) [17,18]. Finally, there is a series resistance (R sol,sub ), which describes the solution and substrate cumulative resistance.…”
Section: Tem Immentioning
confidence: 99%
“…To achieve high crystalline quality as well as economic production, InGaN NWs, previously employed for solar hydrogen generation, were epitaxially grown on silicon (Si) substrates [11,15,16]. Unfortunately, besides having a comparatively low electrical conductivity, growth of InGaN NWs on Si leads to the formation of an amorphous insulating silicon nitride (SiNx) interfacial layer, during the nitrogen rich nucleation phase [17,18]. These issues highly impede transport of excess charge carriers from the NWs to the counter electrode and thus reduce the device performance.…”
Section: Introductionmentioning
confidence: 99%
“…Y. Wang et al reported that Au and Ni, which are typically used as catalytic metals for VLS growth of GaN NWs, introduced deep-level traps in the semiconductor band gap, limiting the performances of optoelectronic devices [14]. To reduce the chemical contamination caused by the metallic catalysts, catalyst-free or self-catalyst methods have been used for the formation of GaN NWs on Si using VLS or Volmer-Weber modes [15][16][17]. However, it is still difficult to form Si-based GaN NWs with high crystal quality because of the large difference in material parameters between GaN and Si, including lattice constants and thermal expansion coefficients.…”
Section: Introductionmentioning
confidence: 99%
“…However, it is still difficult to form Si-based GaN NWs with high crystal quality because of the large difference in material parameters between GaN and Si, including lattice constants and thermal expansion coefficients. That is, catalyst-free GaN NWs on Si substrates showed various shapes and had many structural defects [15,17]. J. Ristić et al reported the spontaneous nucleation and growth mechanisms of GaN nano-columns on Si(111) substrates, which may also apply to form III-nitride nanostructures [18].…”
Section: Introductionmentioning
confidence: 99%