2019
DOI: 10.1002/aelm.201900142
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Ultrathin TiOx Interface‐Mediated ZnO‐Nanowire Memristive Devices Emulating Synaptic Behaviors

Abstract: standard von Neumann architecture. [1][2][3][4][5] Among the different materials that have been developed, the study of synaptic devices based on 1D semiconductor nanomaterials is still very limited, with notable reports on carbon nanotubes, [6] Bi 1−x Sb x nanowires, [7] TiO 2 nanowires, [8] organic P 3 HT-polyethylene oxide coresheath nanowires, [9] etc. These studies form a solid foundation to the integration and assembly of 1D nanomaterials for large-scale neuromorphic computing application. However, due t… Show more

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Cited by 11 publications
(10 citation statements)
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“…Obviously, due to the symmetrical energy band diagram at both ends of the device, a similar charge transfer mechanism is expected at each electrode, leading to the observed symmetrical I-V sweeping behavior. 35,67…”
Section: (G)mentioning
confidence: 99%
“…Obviously, due to the symmetrical energy band diagram at both ends of the device, a similar charge transfer mechanism is expected at each electrode, leading to the observed symmetrical I-V sweeping behavior. 35,67…”
Section: (G)mentioning
confidence: 99%
“…The TiO x ultrathin layer was utilized to eliminate the states/effects on the ZnO nanowire, resulting in excellent threshold resistive switching behaviors. 182 As shown in the diagram in Figure 8e, the TiO x layer acts as a barrier between the ZnO and electrode. Under low electrical field, the oxygen defects in TiO x provide trap sites inducing electron hopping as shown in phase I.…”
Section: Memristor-based Synapse Devicesmentioning
confidence: 99%
“…Therefore, the different trap energy level is responsible for the conductance evolution under external bias excitation. 182 Interfacial engineering is an effective strategy to improve the synaptic performances. Mohit Kumar et al inserted Ag nanowires (AgNWs) to the ZnO/Si interface, which significantly improved the synaptic behaviors.…”
Section: Memristor-based Synapse Devicesmentioning
confidence: 99%
“…The high energy of nanomaterials also enables room-temperature joining [37] for electronic packaging through self-generated heat [38] or ultra-dense atomic defect-motivated fast diffusion [39]. Aside from heat, the control of grain orientation [30], size [40], or interfacial stoichiometry [41] during the joining process could also be employed for the engineering of the high thermal conductivity, ultrahigh yield strength, or electron transportation efficiency of interfacial structures.…”
Section: Micro/nanoscale Joined Interfacesmentioning
confidence: 99%