Ultrathin Thermoelectric Devices for On-Chip Peltier Cooling

Gupta, Man Prakash; Sayer, Metin; Mukhopadhyay, Saibal; Kumar, Satish

doi:10.1109/tcpmt.2011.2159304

Cited by 71 publications

(31 citation statements)

References 19 publications

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“…In another study, by Gupta et al, a numerical Peltier model was developed with steady state and transient response for hotspot cooling [6]. Transient pulses effectively reduced the temperature of hot spots by 6-7…”

Section: Introductionmentioning

confidence: 99%

Investigation of secondary cooling design enhancements in thermally limited compact notebooks

Khan¹,

Uzgoren²,

Muhtaroğlu³

2017

Turk J Elec Eng & Comp Sci

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Thermal design enhancements in a thermally limited compact notebook system are investigated in this paper.System temperature, power, and fan speed are characterized under a range of activity levels. A finite element model is developed, and validated against measurements. Design enhancements improve cooling with minimum intrusion to the existing mechanical design. A passive secondary heat pipe in the system reduces the CPU temperature by 5• C, and improves the system performance through increased CPU + Graphics and Memory Controller Hub (GMCH) thermal design power (TDP) by 6.4%. When such a secondary heat pipe is considered with an integrated off-the-shelf Peltier cooler, the CPU temperature is only reduced by 2.3 • C and CPU+GMCH TDP is improved only by 4.9%. AlthoughPeltier integration provides no benefit to thermals, it can be advantageous in generating small amount of thermoelectric power in conditions when the system is not executing thermally limited applications. Calculations suggest that a 10% increase in Seebeck coefficient and consequently a 5.5% increase in coefficient of performance (COP) of off-the-shelf thermoelectric materials can increase the TDP envelop by 7.1% using the Peltier-integrated secondary heat pipe scheme.

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Section: Introductionmentioning

confidence: 99%

Investigation of secondary cooling design enhancements in thermally limited compact notebooks

Khan¹,

Uzgoren²,

Muhtaroğlu³

2017

Turk J Elec Eng & Comp Sci

View full text Add to dashboard Cite

show abstract

“…The cold temperature is first changed by Peltier effect and after diffusion Joule heat reaches the cold junction affecting it. Some examples of devices which need to be overcooled during a short time are mid-IR laser gas sensors [1], condensation hygrometers and microelectronic processors generating hotspots [2], [3], [4], [5], [6]. The effect of the pulse form has been widely studied in macroscale of lengths.…”

Section: Introductionmentioning

confidence: 99%

Optimization of supercooling effect in nanoscaled thermoelectric layers

Rivera

Figueroa

Vázquez

2016

Communications in Applied and Industrial Mathematics

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In this paper we address the problem of optimization of the so called supercooling effect in thermoelectric nanoscaled layers. The effect arises when a short term electric pulse is applied to the layer. The analysis is based on constitutive equations of the MaxwellCattaneo type describing the time evolution of dissipative flows with the thermal and electric conductivities depending on the width of the layer. This introduces memory and nonlocal effects and consequently a wave-like behaviour of system's temperature. We study the effects of the shape of the electric pulse on the maximum diminishing of temperature by applying pulses of the form t a with a a power going from 0 to 10. Pulses with a a fractionary number perform better for nanoscaled devices whereas those with a bigger than unity do it for microscaled ones. We also find that the supercooling effect is improved by a factor of 6.6 over long length scale devices in the best performances and that the elapsed supercooling time for the nanoscaled devices equals the best of the microscaled ones. We use the spectral methods of solution which assure a well representation of wave behaviour of heat and electric charge in short time scales given their spectral convergence.

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“…1,2 In the context of the latter, miniaturized thin film thermoelectric coolers are of particular significance as an interesting means to address hot spots in microprocessors and optoelectronic devices. [3][4][5][6] On-demand targeted cooling of localized high heat flux regions could significantly reduce the overall cost and energy consumption of current bulk cooling technologies. 4 Given the highly dynamic workload of densely integrated circuits, an increasing need arises for a thorough understanding of the transient behavior of thermoelectric coolers.…”

Section: Introductionmentioning

confidence: 99%

“…[6][7][8][9][10][11][12][13][14] Particular attention was given to the so called supercooling effects [12][13][14] and cooling performance degradation by parasitic electrical and thermal resistances. 4,6,10 The term supercooling expresses the ability to achieve transient active cooling that temporarily exceeds the optimal performance in steady state operation. This phenomenon finds its origin in the fact that Peltier cooling is an interface effect, while its competing Joule counterpart occurs over a bulk region.…”

Section: Introductionmentioning

confidence: 99%

Thermoreflectance imaging of sub 100 ns pulsed cooling in high-speed thermoelectric microcoolers

Vermeersch

Bahk

Christofferson³

et al. 2013

Journal of Applied Physics

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Miniaturized thin film thermoelectric coolers have received considerable attention as potential means to locally address hot spots in microprocessors. Given the highly dynamic workload in complex integrated circuits, the need arises for a thorough understanding of the high-speed thermal behavior of microcoolers. Although some prior work on transient Peltier cooling in pulsed operation is available, these studies mostly focus on theoretical modeling and typically deal with relatively large modules with time constants well into the millisecond range. In this paper, we present an extensive experimental characterization of 30×30 μm2 high-speed coplanar SiGe superlattice microcoolers subjected to 300 ns wide current pulses at ≈ 300 kHz repetition rate. Using thermoreflectance imaging microscopy, we obtain 2D maps of the transient surface temperature and constituent Peltier and Joule components over the 50–750 ns time range with submicron spatial and 50 ns temporal resolutions. Net cooling of 1 K–1.5 K is achieved within 100–300 ns, well over an order of magnitude faster compared to previous reports on microcoolers in high-speed operation. We also point out ambiguities in separating Peltier and Joule signals during the device turn-off. Overall, our measurements provide substantial insight into ultrafast turn-on and turn-off dynamics in thin film thermoelectrics.

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Ultrathin Thermoelectric Devices for On-Chip Peltier Cooling

Cited by 71 publications

References 19 publications

Investigation of secondary cooling design enhancements in thermally limited compact notebooks

Investigation of secondary cooling design enhancements in thermally limited compact notebooks

Optimization of supercooling effect in nanoscaled thermoelectric layers

Thermoreflectance imaging of sub 100 ns pulsed cooling in high-speed thermoelectric microcoolers

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