Ultrathin Glass-Based Wafer-Level Integration for Miniaturized Hermetic MEMS Application

Huang, Yu‐Ting; Tsai, Yi-Chieh; Huang, Yeu‐Shiang; Hu, Han‐Wen; Chen, Kuan‐Neng

doi:10.1109/tcpmt.2022.3232339

Cited by 4 publications

(1 citation statement)

References 20 publications

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“…As a traditional process, spin coating uses high-speed rotation to form a uniform photoresist film on a wafer surface and is widely used in various integrated circuits and biomedical fields. − Hoggan et al employed spin coating to fabricate high-quality thin films of CO 2 -soluble photoresists on wafers. It obtained a roughness of 0.39 nm, and the variation of thickness was 3% at 1500 rpm.…”

Section: Introductionmentioning

confidence: 99%

Inkjet Printing Photoresist with Ultralow Viscosity on Silicon Wafers for Uniform Coating

Wang,

Yang,

Guo

et al. 2024

Langmuir

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Inkjet printing is introduced into the photoresist coating process for uniform photoresist film formation on silicon wafers with the in-house inkjet experimental prototype. The optimization of a dual negative voltage waveform is proposed to achieve stable droplet jetting for the ultralow viscosity (0.71 mPa·s) photoresist with a 1:10 dilution ratio employed in the semiconductor packaging processes. Moreover, the maximum droplet jetting velocity can reach 9.51 m/s, and the droplet volume is controlled at ∼6.5 pL with excellent droplet concentration. The uniform film of the AZ P4620 photoresist is coated on silicon wafers by quantitatively exploring and optimizing the printhead driving frequency and movement velocity utilizing the droplet deposition model and experimental analysis. Results show that the optimal inkjet parameters with 5 kHz in jetting frequency and 6 mm/s in motion velocity can obtain a film evenness index of 4.81% with the thickness of 0.945 μm, which exhibits a more uniform photoresist film than the spray coating method. The study not only expands the application of the inkjet printing technique but also offers an alternative for photoresist coating in the photolithography process.

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Section: Introductionmentioning

confidence: 99%

Inkjet Printing Photoresist with Ultralow Viscosity on Silicon Wafers for Uniform Coating

Wang,

Yang,

Guo

et al. 2024

Langmuir

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Study of masking layer behavior towards bulk micromachining of Borofloat glass

Nigam

Sahu

Priyanka

et al. 2023

Materials Today: Proceedings

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Acoustic-streaming driven liquid filling patterns inside through-glass vias

Sun,

Li,

Wang

et al. 2024

Physics of Fluids

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Filling through-glass vias (TGVs) with liquid remains a significant challenge in IC packaging technology. This study presents an acoustic-streaming method to modulate the wetting behavior as well as the interfacial dynamics to fill the TGVs. We categorize the incomplete filling into three typical patterns: (a) neck wetting, (b) head and end wetting, and (c) bubble wrapping. Experimental results show that the ultrasonic driving at 522.5 kHz/160 V can effectively achieve ideal filling of these patterns in TGVs (aspect ratio of 1:2/1:3). The filling processes are elucidated from a new perspective: the liquid flow induced by acoustic streaming regulates the moving of contact line to complete wetting on sidewalls, while the acoustic wave impacts the gas–liquid interface to cause oscillations for pushing bubbles out. A Lattice Boltzmann model is constructed to reveal the mechanism. This method offers a viable and promising solution to promote liquid filling of TGVs.

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Ultrathin Glass-Based Wafer-Level Integration for Miniaturized Hermetic MEMS Application

Cited by 4 publications

References 20 publications

Inkjet Printing Photoresist with Ultralow Viscosity on Silicon Wafers for Uniform Coating

Inkjet Printing Photoresist with Ultralow Viscosity on Silicon Wafers for Uniform Coating

Study of masking layer behavior towards bulk micromachining of Borofloat glass

Acoustic-streaming driven liquid filling patterns inside through-glass vias

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