Inkjet Printing Photoresist with Ultralow Viscosity on Silicon Wafers for Uniform Coating

Abstract

Inkjet printing is introduced into the photoresist coating process for uniform photoresist film formation on silicon wafers with the in-house inkjet experimental prototype. The optimization of a dual negative voltage waveform is proposed to achieve stable droplet jetting for the ultralow viscosity (0.71 mPa·s) photoresist with a 1:10 dilution ratio employed in the semiconductor packaging processes. Moreover, the maximum droplet jetting velocity can reach 9.51 m/s, and the droplet volume is controlled at ∼6.5 pL with excellent droplet concentration. The uniform film of the AZ P4620 photoresist is coated on silicon wafers by quantitatively exploring and optimizing the printhead driving frequency and movement velocity utilizing the droplet deposition model and experimental analysis. Results show that the optimal inkjet parameters with 5 kHz in jetting frequency and 6 mm/s in motion velocity can obtain a film evenness index of 4.81% with the thickness of 0.945 μm, which exhibits a more uniform photoresist film than the spray coating method. The study not only expands the application of the inkjet printing technique but also offers an alternative for photoresist coating in the photolithography process.