Abstract:This work deals with the effect of solder alloying with a small amount of lanthanum on joint formation with metallic and ceramic substrate. The Bi-Ag – based solder with 2 wt.% lanthanum addition and Bi solder with 2 wt.% lanthanum addition were studied. Soldering was performed by a<br />fluxless process on the air, by activation with a power ultrasound. It was found out that, during the process of ultrasonic soldering, lanthanum is distributed on the boundary, both with the copper and the ceramic substr… Show more
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