ULTRASONIC SOLDERING OF Cu AND Al2O3 CERAMICS BY USE OF Bi-La AND Bi-Ag-La SOLDERS

Abstract

This work deals with the effect of solder alloying with a small amount of lanthanum on joint formation with metallic and ceramic substrate. The Bi-Ag – based solder with 2 wt.% lanthanum addition and Bi solder with 2 wt.% lanthanum addition were studied. Soldering was performed by a<br />fluxless process on the air, by activation with a power ultrasound. It was found out that, during the process of ultrasonic soldering, lanthanum is distributed on the boundary, both with the copper and the ceramic substrate, which enhances the joint formation. The bond with Al<sub>2</sub>O<sub>3 </sub>ceramics is of an adhesive character, without the formation of a new contact interlayer.