“…However, USM is an abrasive-based method that enhances the adhesion of the electroless copper on the glass by creating a roughened in a localized region. Bajpai et al [237] reported the influence of USM-assisted surface roughness of the glass on the electroless deposition of the nickel [238][239][240][241][242][243][244][245][246] followed by copper electrodeposition. Following electroless deposition of nickel, electroless deposition of copper as a seed layer will also show similar results.…”
“…Microcracks and microgrooves are observed on the roughened samples (Figure 35(d)). Figure 35 Ultrasonic-assisted roughening of the glass substrate with two different sets of parameters [237]. [Elsevier License Number – 5327571177387].…”
Section: Adhesion Improvement Using Mechanical Processesmentioning
confidence: 99%
“…Ultrasonic-assisted roughening of the glass substrate with two different sets of parameters [237]. [Elsevier License Number – 5327571177387].…”
Section: Adhesion Improvement Using Mechanical Processesmentioning
confidence: 99%
“…The results of the peel tape test as a qualitative adhesion test are shown in Figure 36. Figure 36 Optical images of peel adhesion test results [237]. [Elsevier License Number – 5327571177387].…”
Section: Adhesion Improvement Using Mechanical Processesmentioning
This article reviews the state-of-the-art electroless copper deposition on glass substrates and the associated challenges.The well-known issue of poor adhesion of electroless copper with the glass substrate was addressed and later, improved bymodifying the surface energy using a specific chemical treatment or by creating localized surface roughening. Localized surfaceregions in the glass were created by abrasive-based ultrasonic machining and hightemperature electrochemical-discharge machiningtechniques. The effect of critical process parameters on the surface roughness and morphology was explained. Both qualitative andquantitative adhesion measurement techniques, such as cross-hatch tests and 90°/180°p eel adhesion tests, were presented. Theadhesion strength is affected by the surface roughness of the substrate and residual stress build-up in the film. As the build-up stresscan be released by the post-deposition annealing, the adhesion strength is further increased. Finally, the electroless coppertechnology in making through-glass-vias and embedded redistribution lines are presented.
“…However, USM is an abrasive-based method that enhances the adhesion of the electroless copper on the glass by creating a roughened in a localized region. Bajpai et al [237] reported the influence of USM-assisted surface roughness of the glass on the electroless deposition of the nickel [238][239][240][241][242][243][244][245][246] followed by copper electrodeposition. Following electroless deposition of nickel, electroless deposition of copper as a seed layer will also show similar results.…”
“…Microcracks and microgrooves are observed on the roughened samples (Figure 35(d)). Figure 35 Ultrasonic-assisted roughening of the glass substrate with two different sets of parameters [237]. [Elsevier License Number – 5327571177387].…”
Section: Adhesion Improvement Using Mechanical Processesmentioning
confidence: 99%
“…Ultrasonic-assisted roughening of the glass substrate with two different sets of parameters [237]. [Elsevier License Number – 5327571177387].…”
Section: Adhesion Improvement Using Mechanical Processesmentioning
confidence: 99%
“…The results of the peel tape test as a qualitative adhesion test are shown in Figure 36. Figure 36 Optical images of peel adhesion test results [237]. [Elsevier License Number – 5327571177387].…”
Section: Adhesion Improvement Using Mechanical Processesmentioning
This article reviews the state-of-the-art electroless copper deposition on glass substrates and the associated challenges.The well-known issue of poor adhesion of electroless copper with the glass substrate was addressed and later, improved bymodifying the surface energy using a specific chemical treatment or by creating localized surface roughening. Localized surfaceregions in the glass were created by abrasive-based ultrasonic machining and hightemperature electrochemical-discharge machiningtechniques. The effect of critical process parameters on the surface roughness and morphology was explained. Both qualitative andquantitative adhesion measurement techniques, such as cross-hatch tests and 90°/180°p eel adhesion tests, were presented. Theadhesion strength is affected by the surface roughness of the substrate and residual stress build-up in the film. As the build-up stresscan be released by the post-deposition annealing, the adhesion strength is further increased. Finally, the electroless coppertechnology in making through-glass-vias and embedded redistribution lines are presented.
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