2020
DOI: 10.1016/j.precisioneng.2020.04.020
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Ultraprecision laser-assisted diamond machining of single crystal Ge

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Cited by 23 publications
(7 citation statements)
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“…Conversely, the In-LAC method has gained widespread usage because it circumvents the disadvantages described above. Micro-LAM Co. developed a commercial OPTIMUS T1 system [20,[84][85][86]. The OPTIMUS T1 system, as shown in figure 5(c), has been successful in achieving the optical machining of silicon with a surface roughness of 1.05 nm in Ra [87].…”
Section: Types Of Lacmentioning
confidence: 99%
“…Conversely, the In-LAC method has gained widespread usage because it circumvents the disadvantages described above. Micro-LAM Co. developed a commercial OPTIMUS T1 system [20,[84][85][86]. The OPTIMUS T1 system, as shown in figure 5(c), has been successful in achieving the optical machining of silicon with a surface roughness of 1.05 nm in Ra [87].…”
Section: Types Of Lacmentioning
confidence: 99%
“…During In-LAC, the material below the cutting edge is heated by a focused laser beam with a spot diameter of micrometers through the transparent diamond tool, thus minimizing the heat affected zone and energy consumption with ideal machining accuracy [151,152]. Previous experimental studies have demonstrated that the ultra-smooth surface of hard brittle materials such as germanium, binderless tungsten carbide and silicon can be achieved with a significant increase in their critical DOCs by using In-LAC technique [153][154][155][156]. Recently, the cutting mechanisms of hard brittle materials in laser-assisted diamond cutting have been widely studied through simulation methods.…”
Section: Thermal-assisted Diamond Cuttingmentioning
confidence: 99%
“…The assembly holding the LDOS comprises of micrometers that allow the alignment of laser beam with respect to the tool edge. The µ-LAM process has proved to enhance the cutting performance of IR materials like Silicon, Ge and ZnS [19][20][21]. Machining of single-crystal Si samples using the µ-LAM process exhibited little to no brittle fracture on the surface and the potential of extending the diamond tooling life by 150% [19].…”
Section: Previous Workmentioning
confidence: 99%
“…Machining germanium using the µ-LAM process produced lower post machining residual stresses on the surface relative to conventional diamond turning. [20].…”
Section: Previous Workmentioning
confidence: 99%