2009
DOI: 10.1063/1.3125252
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Ultralow dark current Ge/Si(100) photodiodes with low thermal budget

Abstract: Vertical incidence photodiodes were fabricated from Ge grown epitaxially on Si(100) by low-energy plasma-enhanced chemical vapor deposition. Consideration of the energy band profiles of n-i-p and p-i-n heterostructures, and optimization of growth processes and thermal budget, allowed the performance of Ge photodectors integrated on Si(100) substrates to be optimized. Record low dark current density of Js=4.1×10−5 A/cm2 and external quantum efficiency at 1550 nm of η=32% were measured.

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Cited by 95 publications
(43 citation statements)
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References 27 publications
(22 reference statements)
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“…In the 864x sample series, grown on [100] silicon wafers, the PH 3 flux was varied in percentage of its maximum value around 1 sccm. In the 933x series, the PH 3 flux was kept at 25% or 40% and three types of substrates were employed: (i) [100] germanium wafer for homo-epitaxial growth resulting in threading dislocation densities in the n-Ge films < 10 5 cm −2 ; (ii) [100] silicon wafers for hetero-epitaxial growth (due to the 4.2% difference between the lattice constants of Si and Ge) of fully relaxed n-Ge films with high dislocation densities of the order of 10 9 cm −2 ; (iii) the same [100] silicon wafers with a 2 µm thick undoped Ge layer (so-called virtual substrate) which is cyclically annealed between 600 and 780 o C to reduce the dislocation density down to 10 7 cm −2 before growing the n-doped film 35 . Indeed, heavily doped n-Ge films cannot be annealed at these temperatures because of the tendency of P atoms to form clusters 33 .…”
Section: Growth Of Heavily Doped Filmsmentioning
confidence: 99%
“…In the 864x sample series, grown on [100] silicon wafers, the PH 3 flux was varied in percentage of its maximum value around 1 sccm. In the 933x series, the PH 3 flux was kept at 25% or 40% and three types of substrates were employed: (i) [100] germanium wafer for homo-epitaxial growth resulting in threading dislocation densities in the n-Ge films < 10 5 cm −2 ; (ii) [100] silicon wafers for hetero-epitaxial growth (due to the 4.2% difference between the lattice constants of Si and Ge) of fully relaxed n-Ge films with high dislocation densities of the order of 10 9 cm −2 ; (iii) the same [100] silicon wafers with a 2 µm thick undoped Ge layer (so-called virtual substrate) which is cyclically annealed between 600 and 780 o C to reduce the dislocation density down to 10 7 cm −2 before growing the n-doped film 35 . Indeed, heavily doped n-Ge films cannot be annealed at these temperatures because of the tendency of P atoms to form clusters 33 .…”
Section: Growth Of Heavily Doped Filmsmentioning
confidence: 99%
“…The dark currents of the Ge FinLED are increased substantially compared with those of the Si FinLED, but the observed ultralow dark current density of 1.86 Â 10 À5 (3.41 Â 10 À3 ) A/cm 2 at the reverse bias of 1(5) V is comparable to those reported as the record low dark currents. 20 The forward currents of the Ge Fin LED are reduced compared with those of the Si FinLED, presumably because of the type II band alignment 8 at the Ge fin/Si electrode interface. Nevertheless, the forward current density of the Ge Fin LED can be extremely high, exceeding the values of 3.40 Â 10 3 (4.62 Â 10 5 ) A/cm 2 at the bias of 1(5) V without a breakdown.…”
mentioning
confidence: 99%
“…The dark current is comparable to some of the best reported from Ge on Si photodetectors. 15 Both the photoluminescence (PL) and electroluminescence from the LED were measured using a Bruker Vertex 70v FTIR system. The FTIR system uses a calcium fluoride beamsplitter and a room temperature extended InGaAs detector, which can detect radiation between 0.8 and 2.5 lm.…”
mentioning
confidence: 99%