2019
DOI: 10.1016/j.actamat.2018.12.043
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Ultrahigh superelastic damping at the nano-scale: A robust phenomenon to improve smart MEMS devices

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Cited by 34 publications
(19 citation statements)
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“…Indeed, a fully closed superelastic cycle is observed, except for a residual depth of about 2–3 nm, observed after the recovery of the first cycle, see Figure 1f, which could be associated with the flattening of the top surface pillar's roughness beneath the indenter, because the second cycle becomes fully closed even at this scale. The critical load to induce the martensitic transformation undergoes a decrease during the first few cycles due to a training effect already reported in other SMAs …”
Section: Resultsmentioning
confidence: 74%
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“…Indeed, a fully closed superelastic cycle is observed, except for a residual depth of about 2–3 nm, observed after the recovery of the first cycle, see Figure 1f, which could be associated with the flattening of the top surface pillar's roughness beneath the indenter, because the second cycle becomes fully closed even at this scale. The critical load to induce the martensitic transformation undergoes a decrease during the first few cycles due to a training effect already reported in other SMAs …”
Section: Resultsmentioning
confidence: 74%
“…d-f) Load-displacement curves, measured by nanocompression tests, illustrating the superelastic behavior of the pillars on the left, respectively. [20,21,26] From the load-displacement curves, and using the measured height and diameter of each pillar, the stress-strain curves shown in Figure 1g-i are easily obtained. g-i) Stress-strain cycles obtained from the previous load-displacement curves, respectively.…”
Section: Superelasticity At the Nanoscalementioning
confidence: 99%
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“…Bu cihazların üretim sürecinde yüzey mikro işlemeyi ve entegre devre ile uyumlu yığın mikro işlemeyi içeren yarı iletken teknolojisi kullanılmaktadır [4,5]. Günümüzde MEMS teknolojisi, otomotiv, biyoteknoloji, askeri ve endüstriyel otomasyon gibi birçok çalışma alanının önemli bir parçasıdır [6][7][8]. MEMS teknolojisinin işlevsel temel öğeleri minyatür yapılar, sensörler, aktüatörler ve mikro elektronik yapılar iken, en dikkat çekici bileşenler mikro-sensörler ve mikro-aktüatörlerdir [9][10][11].…”
Section: Gi̇ri̇ş (Introduction)unclassified