2020
DOI: 10.1021/acsami.0c13144
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Ultracompact Chip-Scale Refractometer Based on an InGaN-Based Monolithic Photonic Chip

Abstract: Optical refractometer constitutes the core element for many applications, from determining the purity and concentration of pharmaceutical ingredients to measuring the sugar content in food and beverages, and the analysis of petroleum. Here, we demonstrated the monolithic integration of light-emitting diodes (LEDs) and photodetectors (PDs) to fabricate ultracompact refractometers with a chip size of 475 × 320 μm2. The light emission and photodetection properties of the devices containing the same InGaN/GaN mult… Show more

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Cited by 18 publications
(10 citation statements)
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“…Monolithic integration of DUV LEDs with photodetectors can facilitate achieving high-performance at the system level. The system-level enhancement originates from the integrated design and device ecosystem, which is also named "systems on a chip" [179][180][181][182][183][184] . For example, Wang et al designed a kind of integrated device composed of an AlGaN-based DUV LED and a multiplicative photoelectric converter (MPC), as shown in Fig . 15 [182] .…”
Section: Monolithic Integrationmentioning
confidence: 99%
“…Monolithic integration of DUV LEDs with photodetectors can facilitate achieving high-performance at the system level. The system-level enhancement originates from the integrated design and device ecosystem, which is also named "systems on a chip" [179][180][181][182][183][184] . For example, Wang et al designed a kind of integrated device composed of an AlGaN-based DUV LED and a multiplicative photoelectric converter (MPC), as shown in Fig . 15 [182] .…”
Section: Monolithic Integrationmentioning
confidence: 99%
“…1(b) and a distributed Bragg reflector (DBR) is used as a bottom mirror to promote upward luminescence. A detailed description of DBR can be found elsewhere [20]. After flip-chip bonding on a printed circuit board, the on-chip emitter and detector are connected with a current source and 0741-3106 © 2021 IEEE.…”
Section: Device Fabricationmentioning
confidence: 99%
“…В одном из вариантов такой интеграции на единой монокристаллической полупроводниковой подложке создают микрооптопару, состоящую из оптически связанных диодных источника и приемника излучения c характерными размерами активных областей от 20 до 300 µm [5][6][7][8]. Под оптической связью при этом подразумевается доставка в приемник излучения источника, вышедшего из полупроводника [5,6], либо доставка излучения, не покидающего монолитный чип, т. е. излучения, распространяющегося внутри прозрачной подложки [7][8][9]. В последнем случае монолитную микрооптопару светодиод (СД) -фотодиод (ФД) можно использовать как датчик многократного нарушенного полного внутреннего отражения (МНПВО), поскольку величина фототока в ФД зависит от показателя преломления и коэффициента поглощения вещества (аналита), имеющего оптический контакт с подложкой.…”
Section: Introductionunclassified