Ultra-violet direct patterning of metal on polyimide

Method for electroless nickel plating on poly(ethylene terephthalate) substrate modified with primer and self-assembled monolayer

“…The metalization of polymer surface are of great interest due to their numerous potential applications in fields such as surface protection [1], microelectronics industry [2], surface decoration [3], and the fabrication of biological devices [4]. Several experimental studies for preparing the metallized polymer were reported including magnetron sputtering deposition [5], electroplate [6], or electroless plating [1][2][3][4].…”

A Study on Surface Modification of Soluble Block Copolymer Polyimide by UV Irradiation and Its Application to Electroless Plating

“…In most cases, one of challenges of such a process was to enhance the adhesion between the PI and metals (e.g., Cu, Ag, and Ni) because PI has hydrophobic nature [12,14]. Surface modification using an UV light is a promising solution because it allows for the remarkable enhancement of adhesion between metals and PI without the increase of surface roughness [15,16].…”

On the Use of Silver Nanoparticles for Direct Micropatterning on Polyimide Substrates

“…The growth was further enhanced by a photochemically assistive polymer coating [11]. The resulting deposition process offers several advantages compared to other fabrication routes.…”

“…Sequential laser write or full exposure through a photomask is also possible. Fine pitch lines down to around 15 µm have been demonstrated using a continuous-wave laser [11] and around 40 µm using UVexposure through a photomask [1]. Finally, the patterning step can be carried out in a dry phase environment and at atmospheric pressure, demonstrating its potential for reel-toreel manufacturing.…”

“…However, prolonged UV irradiation and high temperature treatment can have detrimental effects on the polymer substrate and the process needs optimization to determine the best conditions to generate dense, rough seed metal layers. To date, only preliminary results have been reported [1,11] and in Section III we give a more detailed characterization of the effects of UV energy dose and heat treatment time on the evolution of the silver nanoparticles seed layer and the polyimide substrate. This section also describes the catalytic T TNANO-00032-2011 activity of the nanoparticles for initiation of electroless plating along with a discussion on the adhesion of the deposited electroless metal.…”