Abstract:Package-on-package (PoP) technologies used in smart phones and tablets are reaching limits in logic-to-memory bandwidth and in thickness reduction. Advances in PoP including through-mold vias (TMVs) and low-CTE, highmodulus laminate substrates have not been able to overcome the I/O density and thickness limitations to date. To overcome these barriers, two major technologies have been pursued. The first approach is chip-first embedding in organic dielectrics and in fan-out wafer level packages. While this can a… Show more
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