Ultra Low‐<i>k</i> Films Derived from Hyperbranched Polycarbosilanes (HBPCS)

Rathore, Jitendra S.; Interrante, L. V.; Dubois, Géraud

doi:10.1002/adfm.200801197

Cited by 71 publications

(71 citation statements)

References 18 publications

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“…Recently, it has been demonstrated that the incorporation of alkane bridges in hybrid glasses results in materials with mechanical properties considerably better than glasses containing univalent carbon groups. [6][7][8][9] When organics are incorporated into hybrid glass networks in the form of univalent carbon groups, the molecular connectivity is disrupted and the mechanical properties are signifi cantly degraded. [ 10 ] Thus post-deposition curing to increase the network connectivity by formation of Si-O-Si bonds has been critical to achieve acceptable mechanical properties at the expense of organic component loss, fi lm shrinkage, and degradation of electro-optical performance that accompanies curing.…”

Section: Introductionmentioning

confidence: 99%

Molecular Origins of the Mechanical Behavior of Hybrid Glasses

Oliver

Dubois

Sherwood

et al. 2010

Adv Funct Materials

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Hybrid organic-inorganic glasses exhibit unique electro-optical properties along with excellent thermal stability. Their inherently mechanically fragile nature, however, which derives from the oxide component of the hybrid glass network together with the presence of terminal groups that reduce network connectivity, remains a fundamental challenge for their integration in nanoscience and energy technologies. We report on a combined synthesis and computational strategy to elucidate the effect of molecular structure on mechanical properties of hybrid glass fi lms. We fi rst demonstrate the importance of rigidity percolation to elastic behavior. Secondly, using a novel application of graph theory, we reveal the complex 3-D fracture path at the molecular scale and show that fracture energy in brittle hybrid glasses is fundamentally governed by the bond percolation properties of the network. The computational tools and scaling laws presented provide a robust predictive capability for guiding precursor selection and molecular network design of advanced hybrid organic-inorganic materials.

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Section: Introductionmentioning

confidence: 99%

Molecular Origins of the Mechanical Behavior of Hybrid Glasses

Oliver

Dubois

Sherwood

et al. 2010

Adv Funct Materials

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“…To further illustrate the unique position of nano-architected materials, Figure 3c compares the hollow alumina nanolattices to several other material systems whose porosity can be varied through processing: hyperbranched poly(amidoamine) conjugated silica (HBPCS) (RD 30-90%), 41 silica xerogel (RD 45-64%), 42 silica aerogel (RD 32-40%), 43 and polyimide aerogel with varying amounts of 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) in 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 the backbone of the polyimide (0% 6FDA RD 11-16%, 50% 6FDA RD 5.3-8.1%). 28 The dashed contour represents the same scaling as one shown in Figure 3b for nanolattices with relative densities between 1% and 10%.…”

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confidence: 99%

Enabling Simultaneous Extreme Ultra Low-k in Stiff, Resilient, and Thermally Stable Nano-Architected Materials

et al. 2017

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(GIST), Gwangju 61005, Korea † These authors have contributed equally to this work.Keywords: dielectric constant, low-k, nanolattice, porosity, Young's modulus. AbstractLow dielectric constant (low-k) materials have gained increasing popularity because of their critical role in developing faster, smaller, and higher performance devices. Their practical 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 2 use has been limited by the strong coupling between mechanical, thermal, and electrical properties of materials and their dielectric constant; low-k is usually attained by materials that are very porous, which results in high compliance, i.e. silica aerogels, 39 high dielectric loss, i.e.porous polycrystalline alumina, 25 and poor thermal stability, i.e. Sr-based metal-organic frameworks. 23 We report the fabrication of 3D nano-architected hollow-beam alumina dielectrics whose k is 1.06-1.10 at 1MHz that is stable over the voltage range of -20V to 20V and a frequency range of 100 kHz to 10 MHz. This dielectric material can be used in capacitors and is mechanically resilient, with a Young's modulus of 30 MPa, a yield strength of 1.07 MPa, a nearly full shape recoverability to its original size after >50% compressions, and outstanding thermal stability with a thermal coefficient of dielectric constant (TCK) of 2.43 × 10 -5 K -1 up to 800 °C. These results suggest that nano-architected materials may serve as viable candidates for ultra low-k materials that are simultaneously mechanically-resilient, and thermally and electrically stable for microelectronics and devices. Main TextDesigning and synthesizing low dielectric constant (low-k) materials has been a subject of intense research because of their potential use in high performance technological applications like computer processing, 1,2 wireless communications, [3][4][5][6] and automotive radar. 7 Lowering the k of the interlayer dielectric decreases the resistance-capacitance (RC) delay, lowers power consumption, and reduces cross-talk between nearby interconnects, all of which pose significant issues for modern integrated circuits (ICs). [8][9][10] The low-k property is also favored in low temperature co-fired ceramic (LTCC) technology and represents the backbone of Multi Chip Module (MCM) technology, which enables the integration of passive elements like inductors, 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 3 resistors, and capacitors, which serve as building blocks for 3D circuits for the microwave/millimeter communications industry. [11][12] For example, the antenna in a typical RF module for radiating/receiving radio waves, requires the supporting substrate whose k is sufficiently low to preven...

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“…For these reasons, the choice has been limited to simple alkoxysilane molecules containing a carbon bridge between the silicon atoms (Figure 1.6). These hybrid organicinorganic materials are known in the literature under different names: bridged polysilsesquioxanes [161,162], oxycarbosilanes [1,7,[163][164][165] and carbosiloxanes [166]. Similarly to traditional organosilicates, they are stable up to 425-450 °C in an inert atmosphere and incorporation of a certain level of porosity is necessary to achieve k values below 2.4.…”

Section: Hybrid Organic-inorganic: Oxycarbosilanesmentioning

confidence: 99%

“…Another strategy to prepare porous carbon-bridging containing materials was recently developed by Rathore et al [166]. Their approach is based on the sol-gel processing of hyperbranched polycarbosiloxanes (HBPCSO).…”

Section: Hybrid Organic-inorganic: Oxycarbosilanesmentioning

confidence: 99%