Ultra-fine pitch chip-on-glass (COG) bonding with metal bumps having insulating layer in the side walls using anisotropic conductive film (ACF)

Hong, Myung Hwan; Kim, Sun Chul; Kim, Young Ho

doi:10.1016/j.cap.2011.07.016

Cited by 15 publications

(1 citation statement)

References 12 publications

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“…However, the high temperature generated during welding can easily damage the flexible substrates and circuits ( 40 ). Conductive past strategies involve the combination of polymer adhesives and conductive metal bumps ( 41 ), utilization of anisotropic conductive films ( 42 ), and using light/heat-curable silver adhesives ( 43 ). These methods usually suffer from the problems of low interfacial adhesion strength, mechanical mismatch, or complicated postprocessing.…”

Section: Introductionmentioning

confidence: 99%

Electrically weldable conductive elastomers

Lin,

Zheng,

et al. 2024

Sci. Adv.

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Flexible and stretchable electronic devices are subject to failure because of vulnerable circuit interconnections. We develop a low-voltage (1.5 to 4.5 V) and rapid (as low as 5 s) electric welding strategy to integrate both rigid electronic components and soft sensors in flexible circuits under ambient conditions. This is achieved through the design of conductive elastomers composed of borate ester polymers and conductive fillers, which can be self-welded and generate welding effects to various materials including metals, hydrogels, and other conductive elastomers. The welding effect is generated through the electrochemical reaction–triggered exposure of interfacial adhesive promotors or the cleavage/reformation of dynamic bonds. Our strategy can ensure both mechanical compliance and conductivity at the circuit interfaces and easily produce welding strengths in the kilopascal to megapascal range. The as-designed conductive elastomers in combination with the electric welding technique provide a robust platform for constructing standalone flexible and stretchable electronic devices that are detachable and assemblable on demand.

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Section: Introductionmentioning

confidence: 99%

Electrically weldable conductive elastomers

Lin,

Zheng,

et al. 2024

Sci. Adv.

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Nanoscale‐Dewetting‐Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing

et al. 2020

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As electronics dramatically advance, their components should be fabricated for miniaturized scale, and integrated on limited‐size substrates with extremely high density. Current technologies for the integration and interconnection of electronics show some critical limitations in the application of microscale electronics. To address these problems, herein, a new direct and vertical interconnection driven by selective dewetting of a polymer adhesive is introduced. The interconnection system consists of the polymer adhesive and nanosized metal particles, or structured electrodes. Nanoscale‐dewetting windows formed by controlling the stability and wetting property of the adhesive polymer are controlled by the interfacial property of the coated polymer adhesive. The adhesive is coated on substrate by a simple spin‐coating process, and its ultraviolet curable property allows only the device‐mounted parts to be selectively conductive and sticky, while the other parts form insulation and protection layers. The interconnection of the electronics and substrate by adhesive makes it possible to apply the technique to various microsize electronics with electrode size and pitch of 20 µm or less, and endure dramatic temperature change and a long‐term high humidity environment. Moreover, over display comprising over 10 000 microscale light‐emitting diodes (micro‐LEDs), and commercialized microchips are demonstrated with monolithic integration on flexible and transparent substrate.

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Laser‐Based Micro/Nano‐Processing Techniques for Microscale LEDs and Full‐Color Displays

Gong

2022

Adv Materials Technologies

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Micro light‐emitting diode (Micro‐LED) display is an emerging display technology thanks to its high brightness, fast switching speed, and low power consumption. The commercialization of this technique is being explored by developing advanced processing techniques on an industrial scale. Recent ground‐breaking advances in the manufacture of Micro‐LEDs are mainly based on powerful laser micro/nano‐processing techniques with the unique ability to fabricate materials, structures and devices with the advantages of non‐contacting processing, high efficiency, adjustable coverage from micro‐ to macroscale and the compatibility with organic and inorganic materials. This paper categorizes, reviews and analyzes the main challenges and technical solutions in the Micro‐LED displays by various laser manufacturing processes, covering chip dicing, geometry shaping, laser annealing, laser lift‐off (LLO), laser‐based Micro‐LED transfer, laser‐assist bonding (LAB) and laser repair. The fundamental principles of these techniques are discussed along with their basic mechanisms, followed by an exploration of the latest progress in the field. Finally, a detailed analysis of the advantages and disadvantages of these techniques is given, and the future research directions of laser techniques in Micro‐LED display are discussed.

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Ultra-fine pitch chip-on-glass (COG) bonding with metal bumps having insulating layer in the side walls using anisotropic conductive film (ACF)

Cited by 15 publications

References 12 publications

Electrically weldable conductive elastomers

Electrically weldable conductive elastomers

Nanoscale‐Dewetting‐Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing

Laser‐Based Micro/Nano‐Processing Techniques for Microscale LEDs and Full‐Color Displays

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