Ultra-fast photonic curing of electrically conductive adhesives fabricated from vinyl ester resin and silver micro-flakes for printed electronics

Abstract

Electrically conductive vinyl ester resin–silver micro-flake adhesives, combined with intense pulsed light, present ultra-fast photonic curing within a second.

Cobalt Nanoparticle Inks for Printed High Frequency Applications on Polycarbonate

“…Figure 3 shows 21 which are comparable to our results. Especially the printed layers of 70 vol.% Co ink were mechanically weak, since the porosity and particle agglomeration increased as shown in Fig.…”

3D Printing of Conductive Complex Structures with In Situ Generation of Silver Nanoparticles

“…The simultaneous formation of inorganic and organic phase allows a good distribution of metal nanoparticles in the polymeric network and limits the nanoparticles size . The realization of polymer‐metal nanocomposites by means of photopolymerization process have been used in several papers to obtain electrical conductive materials, capacitors, and materials suitable for electronic . Here, the paper shows that coupling the photoreduction of metal precursor with the 3D printing technology, allows the fabrication of conductive 3D hybrid structures consisting of metal nanoparticles and organic polymers shaped in a complex multilayered architectures.…”

Electrically conductive adhesives based on acrylate resin filled with silver-plated graphite nanosheets and carbon nanotubes

“…Then, the GNs were plunged into a PdCl 2 solution for activation so as to improve the adhesion between the GNs and silver. The weight of activated GNs is 1.032 g. The treated GNs were finally placed into a solution of Ag(NH 3 ) 2 OH, which is prepared by 2.136 g of AgNO 3 . HCHO was added dropwise.…”

“…The traditional Pb/Sn solders are substituted with ECAs in the packaging of microelectronic components and the connection of complex circuits. [3] In some instances, ECAs are indispensable and irreplaceable, for components sensitive to high temperature, for example, as the working temperature of Pb/Sn solders would damage the components. [4] Moreover, ECAs display many other excellent properties, such as being able to go through the curing process at room temperature or low temperature, which prevents the components from being damaged by a process at a high temperature.…”