Ultra-Conformal Metal Coating on High-Aspect-Ratio Three-Dimensional Structures Using Supercritical Fluid: Controlled Selectivity/Non-Selectivity

Synthesis of Metal Nanostructures Using Supercritical Carbon Dioxide: A Green and Upscalable Process

“…[ 186 ] It has also been shown that CuMn x O y can be used as a catalytic layer instead of SiO 2 for the deposition of Cu as shown in Figure . [ 189 ] Conformal deposition of Cu thin films could be achieved in deep trenches with aspect ratio of 50 using the SCFD technique. [ 189 ]…”

“…[ 189 ] Conformal deposition of Cu thin films could be achieved in deep trenches with aspect ratio of 50 using the SCFD technique. [ 189 ]…”

“…Thin-film deposition from scCO 2 has gained particular attention as a new deposition technique for microelectronics applications. [66,175,183,[185][186][187][188][189] The method is sometimes referred to as supercritical fluid deposition (SCFD). [188,189] SCFD is similar to a single-step SFRD and is particularly useful for the fabrication of Cu interconnects of ultra large-scale integration (ULSI) devices.…”

“…[66] It has been shown that device-quality Cu and Ni films could be deposited onto planar and etched silicon substrates using scCO 2 . [186,189] Exceptional step coverage on complex surfaces and complete filling of high-aspect-ratio features of less than 100 nm width were achieved by the reduction of soluble organometallic compounds with H 2 using scCO 2 as solvent. Ni was deposited at low temperature (60 °C) by the reduction of a Ni precursor.…”

“…Reproduced with permission. [189] Copyright 2012, The Japan Society of Applied Physics. Cu-Ag alloy films for microelectronics interconnects were deposited by H 2 reduction from scCO 2 .…”