2021
DOI: 10.48550/arxiv.2109.00308
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Ultra-clean high-mobility graphene on technologically relevant substrates

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“…Hole diameter of 60 μm with a pitch of 280 μm and an Au coating have been selected. Figure 1 shows the adopted procedure of the wet transfer [9], the graphene is coated with PMMA (AR-P 672.045, Allresist) and 15 % poly(propylene) carbonate (PPC) dissolved in Anisole (Sigma-Aldrich) to increase its rigidity [10]. After the etching of graphene from the back side via reactive ion etching (RIE), the copper is etched in an ammonium persulfate (APS, Sigma-Aldrich) solution (0.1 M concentration) overnight.…”
Section: Methodsmentioning
confidence: 99%
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“…Hole diameter of 60 μm with a pitch of 280 μm and an Au coating have been selected. Figure 1 shows the adopted procedure of the wet transfer [9], the graphene is coated with PMMA (AR-P 672.045, Allresist) and 15 % poly(propylene) carbonate (PPC) dissolved in Anisole (Sigma-Aldrich) to increase its rigidity [10]. After the etching of graphene from the back side via reactive ion etching (RIE), the copper is etched in an ammonium persulfate (APS, Sigma-Aldrich) solution (0.1 M concentration) overnight.…”
Section: Methodsmentioning
confidence: 99%
“…Together with growth residuals, such as grain boundaries and metallic residuals [11], affecting the mechanical strength of the membrane, PMMA residuals are also left on the film by the solvents. An ulterior chemical step, to further remove PMMA residues left could be done, as reported by [10], treating the dried device with commercial remover AR-700-61 (Allresist) for three minutes, rinsed with DI water for 10 seconds and dried again in the CPD. After finalizing the transfer, the yield of the covered holes is estimated via scanning electron microscope (SEM) imaging.…”
Section: Jinst 18 C06022mentioning
confidence: 99%