Two regimes of thermal resistance at a liquid–solid interface

Xue, Liping; Keblinski, Pawel; Phillpot, Simon R.; Choi, Seok Jin

doi:10.1063/1.1525806

Cited by 204 publications

(178 citation statements)

References 7 publications

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“…Xue presented a new model for the effective thermal conductivity for nanofluids based on the Maxwell model and average polarisation theory. However, in his model, it is not clear how to determine the depolarisation factor component for the different shapes of particles, and also the thermal conductivity of nanolayers cannot be determined [57]. Another problem with his model is that the predicted thermal conductivity values are matched with experimental data by considering the larger nanolayer thickness, which is not realistic.…”

Section: Nanolayermentioning

confidence: 88%

“…Xue et al [57] used non-equilibrium molecular dynamic simulations in which a temperature gradient was imposed, and they determined the thermal resistance of liquid/solid interface. Their simulation indicates that the strength of the bonding between the liquid and the solid atoms plays a key role in determining the interfacial thermal resistance.…”

Section: Nanolayermentioning

confidence: 99%

See 1 more Smart Citation

A Review of Thermal Conductivity Models for Nanofluids

Aybar

Sharifpur

Azizian

et al. 2015

Heat Transfer Engineering

200

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Section: Nanolayermentioning

confidence: 88%

Section: Nanolayermentioning

confidence: 99%

A Review of Thermal Conductivity Models for Nanofluids

Aybar

Sharifpur

Azizian

et al. 2015

Heat Transfer Engineering

200

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“…Figure 2 presents the averaged number density distribution of the Fe and Ar atoms when both Fe blocks are maintained at 120 K. The figure shows that the fluid atoms adjacent to the solid walls migrate closer toward them due to the Fe-Ar intermolecular interactions to form discrete interfacial layers in agreement with previous investigations. 3,15,17,18,20 The consequent higher Ar atom density at the interface causes a local increase in the interfacial pressure so that the packed fluid layers are quasi-solid-like. Since the fluid is initially a liquidvapor mixture, this inhomogeneous density distribution occurs due to phase segregation.…”

Section: Resultsmentioning

confidence: 99%

“…14 Examples of such MD studies 15 include investigations of heat transfer between simple solid-liquid interfaces 3,16 and of the bonding between liquid and solid atoms. 17 These simulations have been limited to steady state investigations of nanoscale thermal transport across interfaces.…”

Section: Methodsmentioning

confidence: 99%

Unsteady nanoscale thermal transport across a solid-fluid interface

Balasubramanian

Banerjee

Puri

2008

Journal of Applied Physics

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We simulate unsteady nanoscale thermal transport at a solid-fluid interface by placing cooler liquid-vapor Ar mixtures adjacent to warmer Fe walls. The equilibration of the system towards a uniform overall temperature is investigated using nonequilibrium molecular dynamics simulations from which the heat flux is also determined explicitly. The Ar-Fe intermolecular interactions induce the migration of fluid atoms into quasicrystalline interfacial layers adjacent to the walls, creating vacancies at the migration sites. This induces temperature discontinuities between the solidlike interfaces and their neighboring fluid molecules. The interfacial temperature difference and thus the heat flux decrease as the system equilibrates over time. The averaged interfacial thermal resistance R k,av decreases as the imposed wall temperature T w is increased, as R k,av ϰ T w −4.8 . The simulated temperature evolution deviates from an analytical continuum solution due to the overall system heterogeneity.

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“…[5][6][7][8][9][10][11][12][13][14][15] Most of the previous MD studies are mainly focused on how the surface wettability ͑or fluidsurface binding energy͒ and structure are related to R th . Little work has been carried out to understand the effect of flow rate on R th .…”

mentioning

confidence: 99%

Flow dependence of interfacial thermal resistance in nanochannels

Liu

Fan

Zhang

et al. 2010

The Journal of Chemical Physics

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In nanochannel flows, the thermal resistance at the fluid-solid interface may depend on the flow scenario. In this work, we study the interfacial thermal resistance R th in nanoscale force-driven flows at different temperatures and fluid-wall interactions. For Ar flows in Cu and Ag channels, the fluid-wall binding energy is strong and it is found that R th assumes a maximum value as the external force is varied. The maximum value is caused by the fluid adsorption on the solid surfaces and the temperature increase in the fluid due to viscous frictions. However, when the fluid-wall interaction is weak, the maximum value is not observed and the interfacial thermal resistance decreases monotonously with increasing external force. With the presence of fluid adsorption, it is also found that the peak in R th is more detectable at low temperature than high temperature. © 2010 American Institute of Physics. ͓doi:10.1063/1.3327931͔ Thermal management is a key issue in the design of electronic devices. Among the available techniques, the liquid-based cooling methods are quite promising in removing the heat in high-power devices. [1][2][3][4] In certain liquid-based cooling systems, liquid coolants are circulated through micro-or nanoscale channels, which are attached to the heat sources, such as chips. The cooling capacity of such methods depends on the flow rate and thermal resistance at the liquidsolid interface. The flow rate can be controlled by a pump and a high flow rate is usually desired to enhance the cooling capacity. The interfacial thermal resistance R th depends on many parameters, such as the fluid-wall interaction, surface structure, and temperature. 5-10 Our recently work indicates that R th is also associated with the flow rate and the effect of flow rate on the thermal resistance is coupled with the fluidwall interaction and temperature. 11 However, the detailed information about the dependence of R th on the flow rate is unavailable. The coupling of the flow rate, fluid-wall interaction, and R th could be nonlinear and may defy our intuitive understanding that high flow rate improves the cooling capacity. Therefore, it is necessary to explore the relationship between the flow rate and R th under various conditions. This is also important in the design and optimization of liquidbased cooling techniques.Compared with experiments, molecular dynamics ͑MD͒ simulations offer an easy way to investigate the effects of various parameters on the thermal resistance at the fluidsolid interface. 5-15 Most of the previous MD studies are mainly focused on how the surface wettability ͑or fluidsurface binding energy͒ and structure are related to R th . Little work has been carried out to understand the effect of flow rate on R th . In addition, how the thermal resistance is coupled with the flow rate may be affected by the fluid-surface interaction parameters and the fluid heating due to various sources of friction. 11 Although the relationship between the thermal and velocity slips has been numerically investigated, 7 ...

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Two regimes of thermal resistance at a liquid–solid interface

Cited by 204 publications

References 7 publications

A Review of Thermal Conductivity Models for Nanofluids

A Review of Thermal Conductivity Models for Nanofluids

Unsteady nanoscale thermal transport across a solid-fluid interface

Flow dependence of interfacial thermal resistance in nanochannels

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