Abstract:The low-pressure deposition of SiO2 from tetraethylorthosilicate (TEOS) is studied. Experiments have been done to get the profile evolution in trenches of different aspect ratios and at various time steps until closure. A fast analytical simulator, using an adsorption/reemission model, which can handle multiple species, has been developed to simulate the profile evolution. The deposition profiles were simulated using a single or a two rate limiting precursor model. It has been previously shown that low-pressur… Show more
“…The proposed mechanism for SiO 2 deposition involves contributions from a highly reactive TEOS intermediate as well as a slower contribution from the direct surface reaction of the TEOS parent molecule. 8,9,18,19 The addition of TMB and O 2 to the reactor is known to catalyze the TEOS-based deposition of SiO 2 while the addition of either component alone results in no change in the deposition rate. [1][2][3] For example, the SiO 2 growth rate is 3.5 ± 0.5 nm/min for a reactor operated at 675°C and 1.0 torr and a 0.10 torr partial pressure of TEOS.…”
A reaction mechanism and film morphology as a function of reactor conditions and post growth thermal annealing for borosilicate glass (BSG), (SiO 2 ) x (B 2 O 3 ) 1-x , films deposited from tetraethylorthosilicate (TEOS), trimethylborate (TMB), and oxygen (O 2 ) precursors by low-pressure chemical vapor deposition (LPCVD) was determined. An empirically derived reaction model for BSG film growth is proposed that predicts the growth rate and composition of BSG films up to 70 mole% B 2 O 3 . The BSG reaction model includes a strongly adsorbed TEOSderived intermediate that forms SiO 2 and a direct surface reaction of TMB, in O 2 , to form B 2 O 3 . This model is supported by growth rate and mass spectroscopic data. The BSG film morphology, investigated using atomic force microscopy, was found to have a root-mean-square roughness of 0.5 nm, with the precise film morphology being a function of reactor conditions. The BSG film roughness increases with film thickness, temperature, and boron content. Thermal annealing of the films in a water-free environment leads to planarization of the BSG governed by the film composition and anneal temperature.
“…The proposed mechanism for SiO 2 deposition involves contributions from a highly reactive TEOS intermediate as well as a slower contribution from the direct surface reaction of the TEOS parent molecule. 8,9,18,19 The addition of TMB and O 2 to the reactor is known to catalyze the TEOS-based deposition of SiO 2 while the addition of either component alone results in no change in the deposition rate. [1][2][3] For example, the SiO 2 growth rate is 3.5 ± 0.5 nm/min for a reactor operated at 675°C and 1.0 torr and a 0.10 torr partial pressure of TEOS.…”
A reaction mechanism and film morphology as a function of reactor conditions and post growth thermal annealing for borosilicate glass (BSG), (SiO 2 ) x (B 2 O 3 ) 1-x , films deposited from tetraethylorthosilicate (TEOS), trimethylborate (TMB), and oxygen (O 2 ) precursors by low-pressure chemical vapor deposition (LPCVD) was determined. An empirically derived reaction model for BSG film growth is proposed that predicts the growth rate and composition of BSG films up to 70 mole% B 2 O 3 . The BSG reaction model includes a strongly adsorbed TEOSderived intermediate that forms SiO 2 and a direct surface reaction of TMB, in O 2 , to form B 2 O 3 . This model is supported by growth rate and mass spectroscopic data. The BSG film morphology, investigated using atomic force microscopy, was found to have a root-mean-square roughness of 0.5 nm, with the precise film morphology being a function of reactor conditions. The BSG film roughness increases with film thickness, temperature, and boron content. Thermal annealing of the films in a water-free environment leads to planarization of the BSG governed by the film composition and anneal temperature.
“…If A is adopted to indicate the disassemble proportion of the TEOS gas which turns to intermediate reactor, then equation (1) can be written as [2] :…”
Mechanisms during low pressure deposition (LPCVD) process in Micro-Electro-Mechanical Systems (MEMS) and Integrated Circuits (IC) fabrication have been analyzed. The LPCVD process has then been successfully simulated based on the re-emission models with Monte Carlo method and the Lagrangian method (shorthand denoted as L-type method) for boundary movement simulation. Simulation results show an agreement with the available experimental results. This is useful for the research of LPCVD process and the development of MEMS and IC design.
“…We define evolution in the prebiotic sense as the nonreplicative ''propagation'' (persistence) of favorable metabolic ''mutations'' (random physicochemical changes in cell wall catalyst precursors associated with adsorption-reaction sites). The machinery for this pre-RNA version of natural selection is found to emerge quite naturally by modeling the first origin from the perspective of a surface reaction kinetics model [originally developed for condensation/evaporation problems (Willett et al, 2001(Willett et al, , 1999aLoyalka & Griffin, 1993;Li et al, 1995;Islam Raja et al, 1993;Williams & Loyalka, 1991) with applications to diffusion-limited models for gas bubble dynamics (Srinivasan et al, 1999)]. In this more conventional context, the sticking coefficient is defined as the surface-dependent adsorption probability for a specified diffusant (vaporant or metabolite) encountering a vapor-gas/liquid or solid/liquid interface.…”
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