Two-phase heat transfer and high-speed visualization of refrigerant flows in 100 × 100 μm2 silicon multi-microchannels

Szczukiewicz, Sylwia; Borhani, Navid; Thome, John R.

doi:10.1016/j.ijrefrig.2012.11.014

Cited by 90 publications

(14 citation statements)

References 16 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Here the circular channel with 3bar inlet pressure and heat flux of 10to 115KW/m 2 was maintained. The results are similar to that of journal [4] along with two boiling mechanisms such as Nucleate boiling and convective boiling.Carlo Bartoli et al [60] made use of ultrasonic waves in 2010 to enhance the heat transfer. They selected the sub-cooled boiling regime as it suits well for the heat transfer enhancement.…”

Section: Flow Boiling 41 Experimental Studies On Flow Boilingsupporting

confidence: 83%

“…Boye H et al [34] studied the flow boiling heat transfer characteristics similar to previously discussed journal [4]. Here the circular channel with 3bar inlet pressure and heat flux of 10to 115KW/m 2 was maintained.…”

Section: Flow Boiling 41 Experimental Studies On Flow Boilingmentioning

confidence: 95%

“…They observed the significant flow instabilities, backflow, and non-uniform flow distribution among the channels in the micro-evaporator without any inlet restrictions (micro-orifices).Through the experimental tests, it was concluded that the maximum junction temperature of the micro-evaporator T IR was 57 o C for R245fa, 50.3 o C for R236fa, and 43.1 o C for R1234ze (E). It was lower than the given temperature having limit of 85 o C. In addition to the flow analysis of Sylwia Szczukiewicz et al [4] Ahmad Odaymetet al [5]conducted an experimental research on slug flow for condensation in asingle square microchannel. Deionized water is used as the fluidin a controlled steam generator.…”

Section: Sylwiaszczukiewicz Et Al [4]mentioning

confidence: 97%

See 2 more Smart Citations

Review on two-phase flow boiling in oblique fined microchannel heat sink with different channel cross section

2018

IJCTR

View full text Add to dashboard Cite

The research era and development on two-phase flow boiling will give a tremendous choice in various application fields. In spite of this progression, there arise disarray forms under the different streams of thecross-section, oblique fins and types of fluid being used. This study deals on various cross-sections such as rectangular, square, triangle and with avariable aspect ratio of themicrochannel. The paper focuses on the behavior of different types of fluid used in amicrochannel with various thermo-physical properties. The formulated growth in the fields of flow boiling from the introductory to the modern changes is enumerated in both the ways of experimental as well as numerical. In addition to that, this paper concerns the bubble growth rate and heat transfer characteristics of flow boiling experiments. Numerical solutions and their correlations with their experimental data are also summarised. The stimulated improvements in various aspects of microchannel era in experimental and theoretical dataare tabulated. Based on the consolidated database a new model approach on two-phase flow boiling has resulted out.

show abstract

Section: Flow Boiling 41 Experimental Studies On Flow Boilingsupporting

confidence: 83%

Section: Flow Boiling 41 Experimental Studies On Flow Boilingmentioning

confidence: 95%

Section: Sylwiaszczukiewicz Et Al [4]mentioning

confidence: 97%

See 1 more Smart Citation

Review on two-phase flow boiling in oblique fined microchannel heat sink with different channel cross section

2018

IJCTR

View full text Add to dashboard Cite

show abstract

“…Results varied between 0.6 and 1. 8 [Ω], which is within the uncertainty of the individual TSV resistance values (between 0.7 and 2[Ω]).…”

Section: Discussionmentioning

confidence: 89%

“…Indeed, the reliability, performance, and power dissipation of interconnects and transistors are heavily dependent on their operating temperature. Therefore, backside microchannel fluidic cooling concepts, be it single-phase water or two-phase dielectric evaporative cooling using environmentally-friendly refrigerants, were introduced into high-end server products [5][6][7][8].…”

Section: Introductionmentioning

confidence: 99%

Integration of intra chip stack fluidic cooling using thin-layer solder bonding

Madhour

Zervas

Schlottig

et al. 2013

2013 IEEE International 3D Systems Integration Conference (3DIC)

Self Cite

View full text Add to dashboard Cite

Abstract-Three-dimensional (3D) stacking of integratedcircuit (IC) dies by vertical integration increases system density and package functionality. The vertical integration of IC dies by area-array Through-Silicon-Vias (TSVs) reduces the length of global interconnects and accordingly the signal delay time. On the other hand, the ongoing miniaturization trend of ICs results in constantly increasing chip-level power densities. Thus, the development of new chip cooling concepts is of utmost importance. Therefore, scalable cooling solutions for chip stacks, such as interlayer cooling, need to be investigated. This paper presents a new concept for the integration of intra chip stack fluidic cooling, namely die-embedded microchannels for single-and twophase thermal management, using a patterned thin-layer eutectic solder bonding technique for the stack assembly. Results showed the successful fabrication of 5-layer chip stacks with embedded microchannels and high aspect ratio TSVs. Optical inspections demonstrated the proper bond line formation and direct current (DC) daisy-chain electrical tests indicated the successful combination of TSVs with thin-layer solder interconnects. Mechanical shear tests on die-on-die bonded samples showed the strength of the patterned thin-layer solder bond (16MPa). An added solder ring-pad component to seal the electrically active pad from any conductive liquid coolant was also investigated and reflow tests on such geometries showed the appearance of a balling effect along the solder ring line. This balling was found to be mitigated when the ring aspect ratio (deposited solder height to ring width ratio) was kept below the experimentally observed critical value of 0.65.

show abstract

A critical review on measures to suppress flow boiling instabilities in microchannels

Mao

Zhuang

et al. 2021

Heat Mass Transfer

View full text Add to dashboard Cite

Two-phase heat transfer and high-speed visualization of refrigerant flows in 100 × 100 μm2 silicon multi-microchannels

Cited by 90 publications

References 16 publications

Review on two-phase flow boiling in oblique fined microchannel heat sink with different channel cross section

Review on two-phase flow boiling in oblique fined microchannel heat sink with different channel cross section

Integration of intra chip stack fluidic cooling using thin-layer solder bonding

A critical review on measures to suppress flow boiling instabilities in microchannels

Contact Info

Product

Resources

About