Troubleshooting in Sputter Deposition

Sarkar, Jayati

doi:10.1016/b978-0-8155-1593-7.00008-4

Cited by 2 publications

(2 citation statements)

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“…They are held to the substrate surface by electrostatic forces, which affect the micrometer-sized particles much stronger than the gravitational forces. One way to reduce this problem is to occasionally overcoat the brittle and poor adhered deposit of hard coatings with a softer (pure metal) material; this process is called metal layer pasting [56]. Pasting is a high-power sputtering step in metal modes that cleans up the sputter surface and also seals the re-deposited nodules with thin metal layers.…”

Section: Foreign Seed Particlesmentioning

confidence: 99%

“…In the sputtering, material from the target is vaporized as individual atoms or groups of atoms and therefore, in principle, does not generate micro-droplets. In the case of magnetron sputtering the formation of specific seed particles (flakes) are caused by: (a) flaking of cones formed in the target racetrack, (b) flaking of the redeposited nodules from the target surface, and (c) by arcing [56]. In the following text, all three mechanisms are discussed in more detail.…”

Section: Seeds In Magnetron Sputteringmentioning

confidence: 99%

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Review of Growth Defects in Thin Films Prepared by PVD Techniques

et al. 2020

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The paper summarizes current knowledge of growth defects in physical vapor deposition (PVD) coatings. A detailed historical overview is followed by a description of the types and evolution of growth defects. Growth defects are microscopic imperfections in the coating microstructure. They are most commonly formed by overgrowing of the topographical imperfections (pits, asperities) on the substrate surface or the foreign particles of different origins (dust, debris, flakes). Such foreign particles are not only those that remain on the substrate surface after wet cleaning procedure, but also the ones that are generated during ion etching and deposition processes. Although the origin of seed particles from external pretreatment of substrate is similar to all PVD coatings, the influence of ion etching and deposition techniques is rather different. Therefore, special emphasis is given on the description of the processes that take place during ion etching of substrates and the deposition of coating. The effect of growth defects on the functional properties of PVD coatings is described in the last section. How defects affect the quality of optical coatings, thin layers for semiconductor devices, as well as wear, corrosion, and oxidation resistant coatings is explained. The effect of growth defects on the permeation and wettability of the coatings is also shortly described.

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Section: Foreign Seed Particlesmentioning

confidence: 99%

Section: Seeds In Magnetron Sputteringmentioning

confidence: 99%