2019 International 3D Systems Integration Conference (3DIC) 2019
DOI: 10.1109/3dic48104.2019.9058785
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Triple-Layering Technology for Pixel-Parallel CMOS Image Sensors Developed by Hybrid Bonding of SOI Wafers

Masahide Goto1,
Joeri De Vos2,
Toshihisa Watabe3
et al.
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