2017
DOI: 10.1016/j.wear.2017.05.006
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Tribological behavior of copper-molybdenum disulfide composites

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Cited by 62 publications
(31 citation statements)
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“…The experimental data is in good agreement with the equation. The variation of the friction coefficient with the lubricant content is also in agreement with many other MMSCs [10,11,13]. Therefore, the relationships among the friction coefficient, coverage of lubricating film, and volume fraction of the lubricant can be successfully established via the quantitative characterization of the worn surface using XPS.…”
Section: Resultssupporting
confidence: 83%
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“…The experimental data is in good agreement with the equation. The variation of the friction coefficient with the lubricant content is also in agreement with many other MMSCs [10,11,13]. Therefore, the relationships among the friction coefficient, coverage of lubricating film, and volume fraction of the lubricant can be successfully established via the quantitative characterization of the worn surface using XPS.…”
Section: Resultssupporting
confidence: 83%
“…The value of μ m in Eq. (5) is selected from the friction coefficient of pure copper (0.76), and the value of μ f is assigned as 0.1 as the friction coefficient of the MoS 2 pin according to some literatures [12,13,28]. It can be observed that the experimental data agrees well with Eq.…”
Section: Resultsmentioning
confidence: 67%
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“…Copper (Cu) is extensively utilized in disc brakes, contact strips, bearings and electronic packaging materials owing to its good wear resistance, high strength and excellent thermal conductivity at both room and high temperatures. [1][2][3][4][5][6][7][8][9][10] Despite the wide application of copper, there is still an increasing demand for improvement in the tribological and thermal performances of Cu in various industries. For example, high speed trains require brake pads with both excellent wear resistance and heat conduction properties in order to ensure the safe operation of the trains 11 and the integration and packaging of electronic components demand improved thermal performance to increase the energy density.…”
Section: Introductionmentioning
confidence: 99%