Trending IC design directions in 2022

Abstract

For the non-stop demands for a better and smarter society, the number of electronic devices keeps increasing exponentially; and the computation power, communication data rate, smart sensing capability and intelligence are always not enough. Hardware supports software, while the integrated circuit (IC) is the core of hardware. In this long review paper, we summarize and discuss recent trending IC design directions and challenges, and try to give the readers big/cool pictures on each selected small/hot topics. We divide the trends into the following six categories, namely, 1) machine learning and artificial intelligence (AI) chips, 2) communication ICs, 3) data converters, 4) power converters, 5) imagers and range sensors, 6) emerging directions. Hope you find this paper useful for your future research and works.

Design and Implementation of Hybrid DC-DC Converter: A Review

“…The trend in merged architecture of hybrid dc-dc converter has broadened the research direction for power management and conversion, which enables the development of IoT, energy harvesting, telecommunication industry for 4G/5G that supports bandwidth as wide as hundreds of MHz, and compatible battery storage. These applications necessitate high power density and efficiency across a wide dynamic range of VCRs to ensure a well-functioning system throughout the power conversion under different load conditions [8]. As illustrated in Fig.…”

Emerging trends of integrated-mixed-signal chips in ISSCC 2023

“…Regarding this issue, the International Technical-Program Chair for ISSCC 2023 mentioned in the conference proceedings foreword: "ISSCC is, despite of its age, looking to the future, seeking innovative designs more than ever. This goes hand in hand with perform- [1] ; (b) From integrated-circuits to integrated-chips; (c) Cross-layer innovation of devices, circuits, and systems; (d) Quantum computing chips become the spotlight.…”

“…1. (Color online) Emerging trends of integrated-mixed-signal chips in ISSCC 2023: (a) Walk in the middle of analog and digital[1] ; (b) From integrated-circuits to integrated-chips; (c) Cross-layer innovation of devices, circuits, and systems; (d) Quantum computing chips become the spotlight.…”

A Hybrid Single-Inductor Bipolar Triple-Output DC–DC Converter With High-Quality Positive Outputs for AMOLED Displays

“…Recent literature explored compact and low-cost solutions with hybrid and single-inductor multiple-output (SIMO) converters [5], [6], [7], [8], [9], [10], [11], [12], [13], [14] to generate multiple supply rails. The time-multiplexing control (TMC) is applied in [6], [7], and [8] for its immunity to the cross-regulation problem.…”