2D materials are promising to overcome the scaling limit of Si field-effect transistors (FETs). However, the insulator/2D channel interface severely degrades the performance of 2D FETs, and the origin of the degradation remains largely unexplored. Here, the full energy spectra of the interface state densities (D it ) are presented for both n-and p-MoS 2 FETs, based on the comprehensive and systematic studies, i.e., full rage of channel thickness and various gate stack structures with h-BN as well as high-k oxides. For n-MoS 2 , D it around the mid-gap is drastically reduced to 5 × 10 11 cm −2 eV −1 for the heterostructure FET with h-BN from 5 × 10 12 cm −2 eV −1 for the high-k top-gate. On the other hand, D it remains high, ≈10 13 cm −2 eV −1 , even for the heterostructure FET for p-MoS 2 . The systematic study elucidates that the strain induced externally through the substrate surface roughness and high-k deposition process is the origin for the interface degradation on conduction band side, while sulfur-vacancy-induced defect states dominate the interface degradation on valance band side. The present understanding of the interface properties provides the key to further improving the performance of 2D FETs.