2017 IEEE International Reliability Physics Symposium (IRPS) 2017
DOI: 10.1109/irps.2017.7936414
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Trap assisted avalanche instability and safe operating area concerns in AlGaN/GaN HEMTs

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Cited by 15 publications
(5 citation statements)
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“…Figure 5(a) shows the variation in trap density in various regions of the device. A significant increase in trap density is noticed in the gate-drain region [9] with increasing drain stress. Here gate-to-drain trap density increases at a much higher rate than in the gate-tosource region.…”
Section: B Influence Of Stressmentioning
confidence: 93%
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“…Figure 5(a) shows the variation in trap density in various regions of the device. A significant increase in trap density is noticed in the gate-drain region [9] with increasing drain stress. Here gate-to-drain trap density increases at a much higher rate than in the gate-tosource region.…”
Section: B Influence Of Stressmentioning
confidence: 93%
“…MOCVD grown AlGaN/GaN stack, possess a finite defect density which can introduce non-uniformity in carrier trapping and associated peak field shift, at drain, along the device width. Enhanced impact ionization and carrier injection into the buffer, in these localized high field regions invokes avalanche instability and causes multiple damages [9] as seen in Fig. 8(b).…”
Section: Failure Analysismentioning
confidence: 99%
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“…In 2016, Shankar et al [23] reported three failure mechanisms of GaN HEMTs under ESD stress conditions: (a) Devices without mesa isolations and gate contacts fail owing to the migrations of metal contacts from the drain to the source. Metal migrations at the contact corners are remarkable, due to the existence of the largest field crowding there.…”
Section: Electrostatic Discharge (Esd)mentioning
confidence: 99%