“…process temperature and upon annealing is attributed to the increased particle size and hence decreased number of boundaries resulting in the suppression in charge carrier scattering at the boundaries [11, 12, 16 -18]. It is worth to note that with increase in process temperature, T P increases which can be understood as -with increase in process temperature (for both the sintering and annealing processes), particle size increases with the sharp and clear boundaries and hence non-magnetic phase fraction gets suppressed at the boundaries due to decrease in number of Mn-O dangling bonds at the boundaries [16]. This in turn results in the enhancement in transport of e g electrons causing an effective zener double exchange mechanism with increase in T P .…”