Abstract:Epoxy to copper adhesion supports the reliability of numerous structures in electronic packaging. Compared to substrate pre‐treatment, processing and cost considerations are in favor of adhesion promoters loaded in epoxy formulations. In this work, first row transition metal β‐diketonates present such a compelling case when added in epoxy/anhydride resins: over 30% (before moisture aging) and 50% (after moisture aging) enhancement in lap shear strength are found using Co(II) and Ni(II) hexafluoroacetylacetonat… Show more
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