Transition metal compatibilization of poly(vinylamine) and poly(ethylene imine) In memory of Olive M. Belfiore on the 88th anniversary of her birth.

Poly(vinylamine) complexes with f-block salts from the lanthanide series that exhibit significant glass-transition temperature enhancement

“…Large increases in T g seem reasonable if lanthanide metal centers ionically interact with several amino side groups in the polymer 1. Microclustering of polymeric ligands around a single metal cation,2 as illustrated schematically in Figure 5, should induce a large reduction in chain mobility and a large increase in T g . For example, neodymium(III) forms an 18‐coordinate complex with six methyl groups,9 where the CH 2 fragments of all six methyl groups reside in the first‐shell coordination sphere.…”

“…Previous results from this laboratory1, 2 have demonstrated that cobalt chloride hexahydrate induces a 40–45 °C enhancement in T g of poly(vinylamine) per mol % of the metal cation, up to 3 mol % Co 2+ . Results presented herein for poly(vinylamine) complexes with (1) EuCl 3 (H 2 O) 6 and (2) TbCl 3 (H 2 O) 6 surpass those for d 7 cobalt complexes.…”

Highly dispersed silica-supported nanocopper as an efficient heterogeneous catalyst: application in the synthesis of 1,2,3-triazoles and thioethers

“…Because of its abundant positive charge, it is widely used as the stabilizer for the CuNPs to achieve surface functionalization. 61 It also stabilizes Ag, Au, and Pd metal nanoparticles 62a-c and semiconductor quantum dots (QDs). 63 When NaBH 4 is added to CuCl 2 and PEI mixture, colloidal nucleation is achieved and the nanoparticles begin to grow.…”

Silica‐ and Silsesquioxane‐Containing Polymer Nanohybrids

“…Many reports on metal-incorporating polymeric systems are available in the other chapters of this volume and the references therein. [73][74][75][76][77][78] …”

“…It is also true that free volume can easily be occupied by moisture, which increases the dielectric constant because of the inherently high dielectric constant of PVSSQ. 78 The presence of Si-O-Si and Si-O bonds in the cured network structures can also lead to increases in dielectric constants upon increasing the amount of PVSSQ present. 87 Tsai and Whang described CTEs below the T g value of pure polyimide for APTS (p-aminophenyltrimethoxysilane) containing PI; the CTE decreased upon increasing the content of APTS in the hybrid composite films, which is a phenomenon that is due to the increase in the crosslinking density of the network structure that results in increases in both the chain stiffness and the T g value and, therefore, decreasing values of CTE.…”