Transient variation of a cross-sectional area of inkjet-printed silver nanoparticle ink during furnace sintering

Kim, Dong-Keun; Lee, Iksang; Yoo, Young-Tae; Moon, Yoon Jae; Moon, Seok‐Jun

doi:10.1016/j.apsusc.2014.03.110

Cited by 10 publications

(6 citation statements)

References 15 publications

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“…S3F also show that the closely packed silver particles inside the Ag fiber are of tens of nanometers. The overall crystallinity and crystalline size of the iFP Ag fibers compare similarly with literature values of solution processed silver line/fiber features (crystallinity 25 to 60% and crystalline size 20 to 80 nm) (31,32). However, high temperatures (i.e., > 200°C) and postprocessing (i.e., sintering) are usually needed in those approaches; in comparison, iFP operates at sub-90°C in a single step to produce the silver fibers.…”

Section: Morphological and Opto-electro-mechanical Properties Of Ifp supporting

confidence: 78%

Inflight fiber printing toward array and 3D optoelectronic and sensing architectures

et al. 2020

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Scalability and device integration have been prevailing issues limiting our ability in harnessing the potential of small-diameter conducting fibers. We report inflight fiber printing (iFP), a one-step process that integrates conducting fiber production and fiber-to-circuit connection. Inorganic (silver) or organic {PEDOT:PSS [poly(3,4-ethylenedioxythiophene) polystyrene sulfonate]} fibers with 1- to 3-μm diameters are fabricated, with the fiber arrays exhibiting more than 95% transmittance (350 to 750 nm). The high surface area–to–volume ratio, permissiveness, and transparency of the fiber arrays were exploited to construct sensing and optoelectronic architectures. We show the PEDOT:PSS fibers as a cell-interfaced impedimetric sensor, a three-dimensional (3D) moisture flow sensor, and noncontact, wearable/portable respiratory sensors. The capability to design suspended fibers, networks of homo cross-junctions and hetero cross-junctions, and coupling iFP fibers with 3D-printed parts paves the way to additive manufacturing of fiber-based 3D devices with multilatitude functions and superior spatiotemporal resolution, beyond conventional film-based device architectures.

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Section: Morphological and Opto-electro-mechanical Properties Of Ifp supporting

confidence: 78%

Inflight fiber printing toward array and 3D optoelectronic and sensing architectures

et al. 2020

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“…These advantages enable inkjet printing to be adopted in deposition and patterning processes where other types of solution processes are not suitable. There have been reports on inkjet printing of various materials such as sol-gel ink, 1,2 metal [3][4][5][6][7][8] and metal oxide [9][10][11] nanoparticles (NPs), polymers, 3,12,13 ceramics, 14 and their combination, [15][16][17] along with the development of nanocrystal inks composed of various elements. 18,19 In particular, to deposit metal electrodes using inkjet printing, NP-containing ink is dropped and sintered to finalize electrode patterns.…”

Section: Introductionmentioning

confidence: 99%

Highly crystalline Ni/NiO hybrid electrodes processed by inkjet printing and laser-induced reductive sintering under ambient conditions

2016

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In this study, we perform drop-on-demand (DOD) inkjet printing and laser reductive sintering of precrystallized NiO nanoparticle (NP) ink under ambient conditions to obtain NiO/Ni hybrid electrode patterns on a highly localized area. By formulating an inkjet-printable and laser-reducible NiO NP ink, and by exploring the optimum conditions of inkjet printing parameters, we generate stable droplets, enabling arbitrary shapes of NiO NP dot arrays or line patterns to be deposited. Subsequent short-time low-temperature sintering produces highly crystalline NiO electrodes. Furthermore, laser reductive sintering applied on deposited NiO NP patterns can successfully realize a selective transformation of NiO into Ni electrodes under ambient conditions. Therefore, we can define either NiO or Ni electrodes, or a combination of the two on specific areas with precise amounts of ink. In addition, we identify the characteristics of the synthesized NPs, NP ink, NiO and Ni electrodes using various analytical methods.

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“…We obtained electrical conductivity by the in situ measurement of line resistance, and subsequen the thermal conductivity via Equation ( 2). When comparing Equations ( 1) and ( 2), we serve that the information regarding the change in the NP cross-sectional area is requ in the numerical model for estimating the thermal conductivity-dependent temperat However, since the area shrinkage when the NPs are thermally treated for short tim negligible based on the previous study by oven sintering [37], therefore considering a f tion of time taken during the electrical sintering compared to oven sintering, we assum that the area shrinkage remained constant throughout the sintering process. The two mensional heat conduction equation is as follows:…”

Section: Methodsmentioning

confidence: 99%

The Effect of Current Supply Duration during Stepwise Electrical Sintering of Silver Nanoparticles

Lee

Hussain

Lee

et al. 2021

Metals

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We studied the effect of current supply duration at final-step currents during the stepwise electrical sintering of silver (Ag) nanoparticles (NPs). Ag NPs ink was inkjet-printed onto Eagle-XG glass substrates. Constant final-step currents of 0.4 and 0.5 A with various time intervals were applied to the printed samples. The final-step current of 0.5 A damaged the line at a comparatively shorter time duration. On the other hand, the lower final-step current of 0.4 A prevented the line damage at longer time durations while producing comparatively lower Ag NPs specific resistance. The minimum specific resistances of the printed samples sintered at 0.4 and 0.5 A were 3.59 μΩ∙cm and 3.79 μΩ∙cm, respectively. Furthermore, numerical temperature estimation and scanning electron microscope (SEM) analysis were conducted to elaborate on the results. The numerical temperature estimation results implied that the lower estimated peak temperature at the final-step current of 0.4 A helped prevent Ag NP line damage. The SEM micrographs suggested that a high surface porosity—caused by higher sintering peak temperatures—in the case of the 0.5 A final-step current resulted in a comparatively higher Ag NP line-specific resistance. This contribution is a step forward in the development of Ag NP sintering for printed electronics applications.

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Transient variation of a cross-sectional area of inkjet-printed silver nanoparticle ink during furnace sintering

Cited by 10 publications

References 15 publications

Inflight fiber printing toward array and 3D optoelectronic and sensing architectures

Inflight fiber printing toward array and 3D optoelectronic and sensing architectures

Highly crystalline Ni/NiO hybrid electrodes processed by inkjet printing and laser-induced reductive sintering under ambient conditions

The Effect of Current Supply Duration during Stepwise Electrical Sintering of Silver Nanoparticles

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