2020
DOI: 10.1126/sciadv.aba0931
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Inflight fiber printing toward array and 3D optoelectronic and sensing architectures

Abstract: Scalability and device integration have been prevailing issues limiting our ability in harnessing the potential of small-diameter conducting fibers. We report inflight fiber printing (iFP), a one-step process that integrates conducting fiber production and fiber-to-circuit connection. Inorganic (silver) or organic {PEDOT:PSS [poly(3,4-ethylenedioxythiophene) polystyrene sulfonate]} fibers with 1- to 3-μm diameters are fabricated, with the fiber arrays exhibiting more than 95% transmittance (350 to 750 nm). The… Show more

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Cited by 51 publications
(61 citation statements)
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“…These results show that the gelatin microrods were responsive to external environmental conditions, a factor that could underlie their use as promising soft and smart building blocks of complex structures for sensing applications. [ 25,26 ]…”
Section: Resultsmentioning
confidence: 99%
“…These results show that the gelatin microrods were responsive to external environmental conditions, a factor that could underlie their use as promising soft and smart building blocks of complex structures for sensing applications. [ 25,26 ]…”
Section: Resultsmentioning
confidence: 99%
“…iScience Review printing method that integrates conductive fiber preparation and fiber-to-circuit connection to fabricate PEDOT:PSS fibers has been reported (Figure 4C). The PEDOT:PSS fibers, working as noncontact and portable respiratory sensors, can collect both the distribution and direction of exhaled gas (Wang et al, 2020c). Although electronic fibers can easily realize sensing ability, poor selectivity and anti-interference ability are still huge challenges.…”
Section: Sensing Devicesmentioning
confidence: 99%
“…Novel implanted structures bring exciting characteristics to MCP E-skin, such as, non-contact sensing without direct contact, antidamage, and resistance stability after large angle deformation. It is necessary to keep the resistance unchanged when the flexible sensing module is deformed such as bending, which can ensure the stability of the signal transmission of the intelligent system [46]. We chose the best sample preparation parameters of 100 mg/20 mL (MWCNT/liquid), 2 cm width, and 3 layers.…”
Section: Flexible and Anti-damage Performance Of Mcp Eskinmentioning
confidence: 99%