Transient thermal strain measurements in electronic packages

Bastawros, A.F.; Voloshin, Arkady

doi:10.1109/33.62569

Cited by 19 publications

(1 citation statement)

References 10 publications

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“…It has been applied for studies of composite materials [2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18], polycrystalline materials [1,19], piezoelectric materials [20], fracture mechanics [21][22][23][24][25][26][27][28], biomechanics [29], structural elements [30,31], structural joints [32][33][34][35], residual stress measurement [36][37][38][39][40][41][42] and strain gauge calibration [1,43]. More recently, it has been practised extensively in the microelectronics industry to measure thermally induced deformation of electronic packages [44][45][46][47]…”

Section: Introductionmentioning

confidence: 99%

Moiré interferometry for engineering mechanics: Current practices and future developments

Han

Post

Ifju

2001

The Journal of Strain Analysis for Engineering Design

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In the past decade, the optical method called moiré interferometry has matured rapidly to emerge as an invaluable tool, proved by many industrial and scientific applications. It has been applied to numerous problems in engineering mechanics. It measures in-plane displacement fields with high sensitivity and high spatial resolution. This paper reviews current practices of moiré interferometry and its extensions. Applications in diverse fields are addressed to demonstrate the wide applicability of the method, especially the recent applications for thermal deformation analyses of microelectronics devices. Speculation on future developments and practices is presented.

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