Characterization of Stresses and Strains in Microelectronics and Photonics Devices Using Photomechanics Methods

Recent Applications of Moiré Interferometry

“…Thus, the deformation incurred by the temperature increment is locked into the grating and recorded at room temperature. Numerous examples can be found in the literature [20,21,[23][24][25][26][27][28][29][30][31][32][33][34][35][36][37][38][39][40][41].…”

“…La Porta et al [83] used microscopic moiré interferometry with the phase shifting technique to investigate the near-tip fields of a precracked stainless steel specimen under load. The approach proposed by Han and Post was combined with the O/DFM method to document the heterogeneous deformation of titanium in elastic tension [85], the fiber/matrix interactions in a unidirectional Boron/Aluminum metal-matrix composite [86], micromechanical thermal deformations of semiconductor packages and subassemblies [30,41] and the changes in microstrain across bonded dentin interfaces [87]. Figure 13 shows the microscopic displacement fields around two plated-through-holes (PTH), induced by ΔT of −80°C, where the contour interval is 104 nm/fringe [86].…”

“…They were employed to study the temperature-dependent thermo-mechanical behavior. The schemes were implemented with convectiontype or conduction-type environmental chambers that provide the temperature control required in accelerated thermal cycling (isothermal loading) [35,41,[50][51][52][53][54][55][56][57][58][59][60][61][62][63][64][65]. Park et al…”

Miniature Stress Test of Miniature Components Based on Piezoresistive Stress Sensors Test Circuit

“…The digital image analysis enhanced moire interferometry (DIAEMI), can obtain the in-situ out-of-plane displacements of the die, and stresses were calculated by a hybrid finite element method. But it is hard to print fine gratings on the surface of the specimen [5,6]. Moreover, the excess adhesive is critical since it could reinforce the specimen and change the local strain distribution.…”