2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2020
DOI: 10.1109/itherm45881.2020.9190229
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Transient Thermal Analysis of an Air-Conditioned IT Rack with a Thermal Buffering Unit

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“…In addition, using coupled analyses: Maxwell 3D, Fluent CFD, Transient Thermal, allowing for an accurate temperature distribution on the busbars and inside the switchgear [28][29][30][31]. This type of calculation allows the structure to be optimized in terms of high temperature resistance, as well as heat dissipation from the switchgear to the environment [32][33][34][35][36][37]. The novelty of the approach is clearly the cost reduction concerning expensive experimental research and also the ability to reduce materials quantities that ought to be used for switchgear assembly.…”
Section: Introductionmentioning
confidence: 99%
“…In addition, using coupled analyses: Maxwell 3D, Fluent CFD, Transient Thermal, allowing for an accurate temperature distribution on the busbars and inside the switchgear [28][29][30][31]. This type of calculation allows the structure to be optimized in terms of high temperature resistance, as well as heat dissipation from the switchgear to the environment [32][33][34][35][36][37]. The novelty of the approach is clearly the cost reduction concerning expensive experimental research and also the ability to reduce materials quantities that ought to be used for switchgear assembly.…”
Section: Introductionmentioning
confidence: 99%