Transient microscale flow boiling heat transfer characteristics of HFE-7000

Basu, Saptarshi; Werneke, Brian; Peles, Yoav; Jensen, Michael K.

doi:10.1016/j.ijheatmasstransfer.2015.06.038

Cited by 19 publications

(8 citation statements)

References 44 publications

(107 reference statements)

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“…The test rig comprised of an open flow loop for air ( Fig. 1) and a closed flow loop for HFE-7000 [22]. Compressed facility air was used for the air experiments.…”

Section: Experimental Apparatus and Data Acquisitionmentioning

confidence: 99%

“…The closed flow loop comprised of a condenser, preheater, and an auxiliary heat exchanger that were used to control the fluid inlet temperature. A pressure vessel that stored HFE-7000 was added to the closed flow loop [22]. An array of thermocouples and pressure transducers were used to monitor the temperature and pressure at different locations in the test rig.…”

Section: Experimental Apparatus and Data Acquisitionmentioning

confidence: 99%

“…Further details about the microfabrication process and the microdevice is available in Browne [23]. A detailed description of the flow loop, microdevice, and experimental procedures are given in Basu [24,22]. Heater resistance linearly varied with the heater temperature with a negative slope.…”

Section: Experimental Apparatus and Data Acquisitionmentioning

confidence: 99%

“…The data acquisition system (DAQ) comprised of NI LabVIEW hardware and software that was synchronized with the two oscilloscopes (Tektronix TDS2012B and TDS2022B), pulse generator, high-speed camera (Vision Research Phantom V4.2) and a DC power source (Sorensen DLM 600-5E). High frequency transient measurements of the current and voltage as well as the camera images were synchronized with the power pulse using a MOSFET based switching circuit ( [22]).…”

Section: Experimental Apparatus and Data Acquisitionmentioning

confidence: 99%

“…A detailed description of the measurement considerations is provided in Basu et al [22] and Basu [24]. The heater temperature was correlated to its resistance that was based on current and voltage measurements.…”

Section: Measurement Considerationsmentioning

confidence: 99%

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Thermal behavior of a microdevice under transient heat loads

Basu

Werneke

Peles

et al. 2015

International Journal of Heat and Mass Transfer

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An experimental study was carried out to investigate the transient response of a thermal microsystem to both a step change and a square wave pulse change in heat flux. The microsystem consisted of a single microchannel etched on a silicon microdevice that was bonded to a Pyrex wafer. A thin-film titanium heater was deposited on the Pyrex substrate. The heater acted as the power source as well as the resistance temperature device. The influence of flow convection on the transient response was studied for two fluids: air and HFE-7000. The effects of heat flux, Reynolds number, fluid properties, and pulse parameters (amplitude, width, duty cycle) on the transient temperature response were identified. The temperature response consisted of an initial rapid temperature rise followed by slower convection dynamics. For longer pulse widths, the temperature of the microdevice reached steady state. Higher order dynamics were identified at the beginning of the temperature response. Convection dynamics were approximated as a first-order response, and the effects of Reynolds number and fluid properties on the time constant of the first order response were identified.

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“…The test rig comprised of an open flow loop for air ( Fig. 1) and a closed flow loop for HFE-7000 [22]. Compressed facility air was used for the air experiments.…”

Section: Experimental Apparatus and Data Acquisitionmentioning

confidence: 99%

Section: Experimental Apparatus and Data Acquisitionmentioning

confidence: 99%