2016
DOI: 10.7567/jjap.55.04ec14
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Transient liquid-phase sintering using silver and tin powder mixture for die bonding

Abstract: In this research, we develop transient liquid-phase bonding by uniaxial pressing using a Ag–Sn system. The Ag–Sn system was fabricated using Ag and Sn fine powder paste at optimized the proportions. The die bonding was performed for Cu substrates and metalized Si chips, and the sintering process was analyzed by cross-sectional observation. Die shear strength of bonded specimens was also measured. As a result, Ag–Sn completely formed a solid solution, also, Sn and Cu from substrates formed an intermetallic comp… Show more

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Cited by 27 publications
(9 citation statements)
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“…Also, in our previous study, the relative density and ultimate shear strength of the Fe–30Mn, Fe–30Mn–1Ag, and Fe–30Mn–3Ag alloys were measured as 71%, 80%, and 89% and 172, 360, and 490 MPa, respectively. The addition of Ag helped the sintering by forming liquid-phase sintering and by decreasing the porosities …”
Section: Results and Discussionmentioning
confidence: 99%
See 1 more Smart Citation
“…Also, in our previous study, the relative density and ultimate shear strength of the Fe–30Mn, Fe–30Mn–1Ag, and Fe–30Mn–3Ag alloys were measured as 71%, 80%, and 89% and 172, 360, and 490 MPa, respectively. The addition of Ag helped the sintering by forming liquid-phase sintering and by decreasing the porosities …”
Section: Results and Discussionmentioning
confidence: 99%
“…The addition of Ag helped the sintering by forming liquid-phase sintering and by decreasing the porosities. 29 3.2. Static Immersion Test.…”
Section: Resultsmentioning
confidence: 99%
“…2d). The addition of silver helped the SPS consolidation by promoting liquid phase sintering [31]. The melted silver pulled metal particles together and thus reduce pore formation [32] resulting in the increase of relative density to 93±2 % for the NS1A.…”
Section: Accepted Manuscriptmentioning
confidence: 99%
“…At present, some TLPS systems have been reported, such as Sn-Bi-Ag, Ag-Sn, Cu-Sn, Ag-In, Ni-Sn, and so on (Ohnμma et al, 2012;Wu et al, 2012;Lee et al, 2015;Fujino et al, 2016;Tatsumi et al, 2019). For Cu-In TLPS system, the melting point of In (157°C) is lower than Sn (232°C), which enables the bonding process to be carried out at a lower temperature.…”
Section: Introductionmentioning
confidence: 99%