2007
DOI: 10.1088/1367-2630/9/8/280
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Transient depletion of source gases during materials processing: a case study on the plasma deposition of microcrystalline silicon

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Cited by 33 publications
(31 citation statements)
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“…2,17,18 High pressure depletion process settings included a power range ͑P rf ͒ of 60-120 W, a pressure ͑p dep ͒ range of 5-15 Torr, a substrate temperature of 200°C, and a H 2 flow ͑f H2 ͒ of 360 SCCM ͑SCCM denotes cubic centimeter per minute at STP͒. For each fixed setting of p dep and P rf , the SiH 4 flow ͑f SiH4 ͒ was varied between 0 and 10 SCCM to deposit films ranging from highly crystalline to purely amorphous silicon.…”
mentioning
confidence: 99%
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“…2,17,18 High pressure depletion process settings included a power range ͑P rf ͒ of 60-120 W, a pressure ͑p dep ͒ range of 5-15 Torr, a substrate temperature of 200°C, and a H 2 flow ͑f H2 ͒ of 360 SCCM ͑SCCM denotes cubic centimeter per minute at STP͒. For each fixed setting of p dep and P rf , the SiH 4 flow ͑f SiH4 ͒ was varied between 0 and 10 SCCM to deposit films ranging from highly crystalline to purely amorphous silicon.…”
mentioning
confidence: 99%
“…More information on the used linear dependence is given in Ref. 18. Note that this procedure should be repeated for every fixed plasma setting throughout a f SiH4 optimization series.…”
mentioning
confidence: 99%
“…The H 2 plasma treatment time was set at Ͻ60 s to diminish H-induced material modification 11,14,18 and the influence of redeposition. 19,20 The time averaged baseline corrected SiH * emission at 414.3 nm proved to scale with the SiH 4 density 13,21 and is used here as a measure for the abundance of etch products during H 2 plasma treatment. After H 2 treatment the next cycle commences with the deposition of a fresh silicon film on top of the previous film using a different SiH 4 flow.…”
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confidence: 99%
“…Low initial I RS C results from transient depletion of the process gases which typically occurs in PECVD processes. 13,23,41 For the subsequent layer growth crystallites evolve conically and I RS C increases. 1,9 Decreasing I RS C under comparably high SC conditions was also observed previously by TEM measurements: 9 In these experiments thin-film silicon was grown on crystalline silicon substrates for process conditions which promote low I RS C .…”
Section: First Imentioning
confidence: 99%